Datenblatt-Suchmaschine für elektronische Bauteile |
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TLP921 Datenblatt(PDF) 3 Page - Toshiba Semiconductor |
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TLP921 Datenblatt(HTML) 3 Page - Toshiba Semiconductor |
3 / 8 page TLP921 2002-04-03 3 Handling Precautions · When removing flux with chemicals after soldering, clean only the soldered part of the leads. Do not immerse the entire package in the cleaning solvent. Chemical residue on the LED emitter or the photodetector inside the phototransistor case may adversely affect the optical characteristics of the device and may drastically reduce the collector current. · The case is made of polybutylene-terephthalate. Oil or chemicals may cause the package to melt or crack. Care must be taken in relation to the environment in which the device is to be installed. · Mount the device on a level surface. · The collector current characteristic will deteriorate over time due to current flowing in the infrared LED. The design of circuits which incorporate the device must take into account the change in collector current over time. · When the 2-mm hole is used as screw fixation, please fastening torque 0.1 N or less. |
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