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74AHCT2G241 Datenblatt(PDF) 2 Page - NXP Semiconductors |
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74AHCT2G241 Datenblatt(HTML) 2 Page - NXP Semiconductors |
2 / 19 page 9397 750 12887 © Koninklijke Philips Electronics N.V. 2004. All rights reserved. Product data sheet Rev. 01 — 10 March 2004 2 of 19 Philips Semiconductors 74AHC2G241; 74AHCT2G241 Dual buffer/line driver; 3-state [1] CPD is used to determine the dynamic power dissipation (PD in µW). PD =CPD × VCC2 × fi × N+ ∑(CL × VCC2 × fo) where: fi = input frequency in MHz; fo = output frequency in MHz; CL = output load capacitance in pF; VCC = supply voltage in Volts; N = total load switching outputs; ∑(C L × VCC 2 × f o) = sum of outputs. [2] The condition is VI = GND to VCC. 4. Ordering information 5. Marking Type 74AHCT2G241 tPHL, tPLH propagation delay nA to nY CL = 15 pF; VCC = 5 V - 3.4 5.5 ns tPZH, tPZL enable time1OE to 1Y CL = 15 pF; VCC = 5 V - 3.9 5.1 ns enable time 2OE to 2Y CL = 15 pF; VCC = 5 V - 3.4 5.6 ns tPHZ, tPLZ disable time1OE to 1Y CL = 15 pF; VCC = 5 V - 4.5 6.8 ns disable time 2OE to 2Y CL = 15 pF; VCC = 5 V - 4.0 6.8 ns CI input capacitance - 1.5 10 pF CPD power dissipation capacitance CL = 50 pF; f = 1 MHz [1] [2] -10 - pF Table 1: Quick reference data …continued GND = 0 V; Tamb =25 °C; tr =tf ≤ 3.0 ns. Symbol Parameter Conditions Min Typ Max Unit Table 2: Ordering information Type number Package Temperature range Name Description Version 74AHC2G241DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74AHCT2G241DP −40 °C to +125 °C TSSOP8 plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm SOT505-2 74AHC2G241DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 74AHCT2G241DC −40 °C to +125 °C VSSOP8 plastic very thin shrink small outline package; 8 leads; body width 2.3 mm SOT765-1 Table 3: Marking Type number Marking code 74AHC2G241DP A241 74AHCT2G241DP C241 74AHC2G241DC A41 74AHCT2G241DC C41 |
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