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NCV47721 Datenblatt(PDF) 4 Page - ON Semiconductor |
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NCV47721 Datenblatt(HTML) 4 Page - ON Semiconductor |
4 / 16 page NCV47721 www.onsemi.com 4 Table 2. MAXIMUM RATINGS Rating Symbol Min Max Unit Input Voltage DC Vin −42 45 V Input Voltage (Note 1) Load Dump − Suppressed Us* − 60 V Enable Input Voltage VEN −42 45 V ADJ Input Voltage VADJ −0.3 10 V CSO Voltage VCSO −0.3 7 V DE, EF Voltages VDE, VEF −0.3 7 V Output Voltage Vout −1 40 V Junction Temperature TJ −40 150 °C Storage Temperature TSTG −55 150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in production. Passed Class A according to ISO16750−1. Table 3. ESD CAPABILITY (Note 2) Rating Symbol Min Max Unit ESD Capability, Human Body Model ESDHBM −2 2 kV 2. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010) Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50 mm2 due to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform characteristic defined in JEDEC JS−002−2014. Table 4. LEAD SOLDERING TEMPERATURE AND MSL (Note 3) Rating Symbol Min Max Unit Moisture Sensitivity Level MSL 1 − 3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D THERMAL CHARACTERISTICS (Note 4) Rating Symbol Value Unit Thermal Characteristics (single layer PCB) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead (Note 5) RθJA RψJL 62.6 23.7 °C/W Thermal Characteristics (4 layers PCB) Thermal Resistance, Junction−to−Air (Note 5) Thermal Reference, Junction−to−Lead (Note 5) RθJA RψJL 44.1 16.8 °C/W 4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area. 5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3, 4 layers − according to JEDEC51.7 Table 5. RECOMMENDED OPERATING RANGES Rating Symbol Min Max Unit Input Voltage (Note 6) Vin 4.4 40 V Nominal Output Voltages Vout_nom 3.3 20 V Output Current Limit (Note 7) ILIM 10 300 mA Junction Temperature TJ −40 150 °C Current Sense Output (CSO) Capacitor CCSO 1 4.7 mF Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability. 6. Minimum Vin = 4.4 V or (Vout + 0.5 V), whichever is higher. 7. Corresponding RCSO is in range from 25.5 kW down to 850 W. |
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Ähnliche Beschreibung - NCV47721 |
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