Datenblatt-Suchmaschine für elektronische Bauteile |
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ACT4911QW Datenblatt(PDF) 27 Page - Active-Semi, Inc |
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ACT4911QW Datenblatt(HTML) 27 Page - Active-Semi, Inc |
27 / 33 page ACT4911QW Rev 1.0, 15-Sept-2017 Innovative PowerTM www.active-semi.com ActiveSwitcherTM is a trademark of Active-Semi Copyright © 2017 Active-Semi, Inc. 27 PC board layout guidance Proper parts placement and PCB layout are critical to the operation of switching power supplies. Follow the following layout guidelines when designing the ACT4911 PCB. Refer to the Active-Semi ACT4911 Evaluation Kits for layout examples 1. Place the buck input capacitors as close as possible to the IC. Connect the input capacitors directly between STR and PGND pins on the top layer. Routing these traces on the top layer eliminates the need for vias. 2. Minimize the switch node trace length between the SW pin and the inductor. Optimal switch node routing is to run the trace between the in- put capacitor’s pads. Using 1206 or larger sized input capacitors is recommended. Avoid routing sensitive analog signals near these high fre- quency, high dV/dt traces. 3. The Buck output capacitors should be placed by the inductor and connected directly to the in- ductor and ground plane with short and wide traces. The output capacitor ground should make a short connection to the input capacitor ground. If required, use multiple vias. 4. The FB pin should be Kelvin connected to the output capacitor through the shortest possible route, while keeping sufficient distance from switching node to prevent noise injection. The IC regulates the output voltage to this Kelvin connection. 5. Connect the PGND and VSS ground pins must be electrically connected together. The VSS ground plane should be isolated from the rest of the PCB power ground. 6. Remember that all open drain outputs need pull-up resistors. 7. Connect the exposed pad directly to the top layer ground plane. Connect the top layer ground plane to both internal ground planes and the PCB backside ground plane with ther- mal vias. Provide ground plane routing on mul- tiple layers to allow the IC’s heat to flow into the PCB and then spread radially from the IC. Avoid cutting the ground planes or adding vias that re- strict the radial flow of heat. |
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