Datenblatt-Suchmaschine für elektronische Bauteile |
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SFH325FA Datenblatt(PDF) 8 Page - OSRAM GmbH |
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SFH325FA Datenblatt(HTML) 8 Page - OSRAM GmbH |
8 / 14 page 2015-12-14 8 Version 1.3 SFH 325 FA Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020D.01 0 0 s OHA04525 50 100 150 200 250 300 50 100 150 200 250 300 t T ˚C S t t P t T p 240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profil-Charakteristik Profile Feature Ramp-up Rate to Preheat*) 25 °C to 150 °C 2 3 K/s Time t S T Smin to TSmax t S t L t P T L T P 100 120 60 10 20 30 80 100 217 2 3 245 250 3 4 Time 25 °C to T P Time within 5 °C of the specified peak temperature T P - 5 K Ramp-down Rate* T P to 100 °C All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range Ramp-up Rate to Peak*) T Smax to T P Liquidus Temperature Peak Temperature Time above Liquidus temperature Symbol Symbol Einheit Unit Pb-Free (SnAgCu) Assembly Minimum Maximum Recommendation K/s K/s s s s s °C °C 480 |
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