 |
Datenblatt-Suchmaschine für elektronische Bauteile |
|
|
Datenblatt-Suchmaschine für elektronische Bauteile |
|
INA819 Datenblatt(PDF) 33 Page - Texas Instruments |
|
|
||||||||||||||||||||||||||||||
INA819 Datenblatt(HTML) 33 Page - Texas Instruments |
|
|
33 / 43 page  33 INA819 www.ti.com SBOS959 – DECEMBER 2018 Product Folder Links: INA819 Submit Documentation Feedback Copyright © 2018, Texas Instruments Incorporated 10 Power Supply Recommendations The nominal performance of the INA819 is specified with a supply voltage of ±15 V and midsupply reference voltage. The device can also be operated using power supplies from ±2.25 V (4.5 V) to ±18 V (36 V) and non midsupply reference voltages with excellent performance. Parameters that can vary significantly with operating voltage and reference voltage are shown in Typical Characteristics. 11 Layout 11.1 Layout Guidelines Attention to good layout practices is always recommended. For best operational performance of the device, use good PCB layout practices, including: • Take care to ensure that both input paths are well-matched for source impedance and capacitance to avoid converting common-mode signals into differential signals. Even slight mismatch in parasitic capacitance at the gain setting pins can degrade CMRR over frequency. For example, in applications that implement gain switching using switches or PhotoMOS® relays to change the value of RG, select the component so that the switch capacitance is as small as possible and most importantly so that capacitance mismatch between the RG pins is minimized. • Noise can propagate into analog circuitry through the power pins of the circuit as a whole and of the device itself. Bypass capacitors reduce the coupled noise by providing low-impedance power sources local to the analog circuitry. – Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single- supply applications. • To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicular is much better than in parallel with the noisy trace. • Place the external components as close to the device as possible. As shown in Figure 75, keeping RG close to the pins minimizes parasitic capacitance. • Keep the traces as short as possible. |
Ähnliche Teilenummer - INA819 |
|
Ähnliche Beschreibung - INA819 |
|
|
Link URL |
| Privatsphäre und Datenschutz |
| ALLDATASHEETDE.COM |
| War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
| Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
|
Family Site : ic2ic.com |
icmetro.com |
German ▼
English
Chinese
German
Japanese
Russian
Korean
Spanish
French
Italian
Portuguese
Polish
Vietnamese
Indian
Mexican
British
New Zealand
