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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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MC100LVE164 Datenblatt(PDF) 3 Page - ON Semiconductor |
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MC100LVE164 Datenblatt(HTML) 3 Page - ON Semiconductor |
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3 / 4 page  MC100LVE164 4–3 MOTOROLA ECLinPS and ECLinPS Lite DL140 — Rev 3 OUTLINE DIMENSIONS FA SUFFIX TQFP PACKAGE CASE 873A-02 ISSUE A DETAIL Y A S1 V B 1 8 9 17 25 32 AE AE P DETAIL Y BASE N J D F METAL SECTION AE–AE G SEATING PLANE R Q _ W K X E C H DETAIL AD NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DATUM PLANE –AB– IS LOCATED AT BOTTOM OF LEAD AND IS COINCIDENT WITH THE LEAD WHERE THE LEAD EXITS THE PLASTIC BODY AT THE BOTTOM OF THE PARTING LINE. 4 DATUMS –T–, –U–, AND –Z– TO BE DETERMINED AT DATUM PLANE –AB–. 5 DIMENSIONS S AND V TO BE DETERMINED AT SEATING PLANE –AC–. 6 DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE PROTRUSION IS 0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO INCLUDE MOLD MISMATCH AND ARE DETERMINED AT DATUM PLANE –AB–. 7 DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. DAMBAR PROTRUSION SHALL NOT CAUSE THE D DIMENSION TO EXCEED 0.520 (0.020). 8 MINIMUM SOLDER PLATE THICKNESS SHALL BE 0.0076 (0.0003). 9 EXACT SHAPE OF EACH CORNER MAY VARY FROM DEPICTION. DIM A MIN MAX MIN MAX INCHES 7.000 BSC 0.276 BSC MILLIMETERS B 7.000 BSC 0.276 BSC C 1.400 1.600 0.055 0.063 D 0.300 0.450 0.012 0.018 E 1.350 1.450 0.053 0.057 F 0.300 0.400 0.012 0.016 G 0.800 BSC 0.031 BSC H 0.050 0.150 0.002 0.006 J 0.090 0.200 0.004 0.008 K 0.500 0.700 0.020 0.028 M 12 REF 12 REF N 0.090 0.160 0.004 0.006 P 0.400 BSC 0.016 BSC Q 1 5 1 5 R 0.150 0.250 0.006 0.010 V 9.000 BSC 0.354 BSC V1 4.500 BSC 0.177 BSC _ _ _ _ _ _ DETAIL AD A1 B1 V1 4X S 4X B1 3.500 BSC 0.138 BSC A1 3.500 BSC 0.138 BSC S 9.000 BSC 0.354 BSC S1 4.500 BSC 0.177 BSC W 0.200 REF 0.008 REF X 1.000 REF 0.039 REF 9 –T– –Z– –U– T–U 0.20 (0.008) Z AC T–U 0.20 (0.008) Z AB 0.10 (0.004) AC –AC– –AB– M _ 8X |
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