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MC100E112 Datenblatt(PDF) 2 Page - ON Semiconductor |
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MC100E112 Datenblatt(HTML) 2 Page - ON Semiconductor |
2 / 4 page MC10E112 MC100E112 MOTOROLA ECLinPS and ECLinPS Lite DL140 — Rev 4 2–2 DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0 °C 25 °C 85 °C Symbol Characteristic min typ max min typ max min typ max Unit Condition IIH Input HIGH Current µA D 200 200 200 EN 200 200 200 IEE Power Supply Current mA 10E 47 56 47 56 47 56 100E 47 56 47 56 54 65 AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND) 0 °C 25 °C 85 °C Symbol Characteristic min typ max min typ max min typ max Unit Condition tPLH Propagation Delay to Output ps tPHL D 200 400 600 200 400 600 200 400 600 EN 275 450 675 275 450 675 275 450 675 tSKEW Within-Device Skew ps Dn to Qn, Qn 80 80 80 1 Qna to Qnb 40 40 40 2 tr Rise/Fall Times ps tf 20 - 80% 275 425 700 275 425 700 275 425 700 1. Within-device skew is defined as identical transitions on similar paths through a device. 2. Skew defined between common OR or common NOR outputs of a single gate. |
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