MC10E112 MC100E112

MOTOROLA

ECLinPS and ECLinPS Lite

DL140 — Rev 4

2–2

DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)

0

°C

25

°C

85

°C

Symbol

Characteristic

min

typ

max

min

typ

max

min

typ

max

Unit

Condition

IIH

Input HIGH Current

µA

D

200

200

200

EN

200

200

200

IEE

Power Supply Current

mA

10E

47

56

47

56

47

56

100E

47

56

47

56

54

65

AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)

0

°C

25

°C

85

°C

Symbol

Characteristic

min

typ

max

min

typ

max

min

typ

max

Unit

Condition

tPLH

Propagation Delay to Output

ps

tPHL

D

200

400

600

200

400

600

200

400

600

EN

275

450

675

275

450

675

275

450

675

tSKEW

Within-Device Skew

ps

Dn to Qn, Qn

80

80

80

1

Qna to Qnb

40

40

40

2

tr

Rise/Fall Times

ps

tf

20 - 80%

275

425

700

275

425

700

275

425

700

1. Within-device skew is defined as identical transitions on similar paths through a device.

2. Skew defined between common OR or common NOR outputs of a single gate.