MC10H145

MOTOROLA

MECL Data

DL122 — Rev 6

2–234

AC PARAMETERS

MC10H145

TA = 0 to +75°C,

VEE = –5.2 Vdc ±5%

Characteristics

Symbol

Min

Max

Unit

Conditions

Read Mode

Chip Select Access Time

Chip Select Recovery Time

Address Access Time

tACS

tRCS

tAA

0

0

0

4.0

4.0

6.0

ns

Measured from 50% of input to 50%

of output. See Note 2.

Write Mode

Write Pulse Width

Data Setup Time Prior to Write

Data Hold Time After Write

Address Setup Time Prior to Write

Address Hold Time After Write

Chip Select Setup Time Prior to Write

Chip Select Hold Time After Write

Write Disable Time

Write Recovery Time

tW

tWSD

tWHD

tWSA

tWHA

tWSCS

tWHCS

tWS

tWR

6.0

0

1.5

3.5

1.5

0

1.5

1.0

1.0

—

—

—

—

—

—

—

4.0

4.0

ns

tWSA = 3.5 ns

Measured at 50% of input to 50% of

output. tW = 6.0 ns.

Chip Enable Strobe Mode

Data Setup Prior to Chip Select

Write Enable Setup Prior to Chip Select

Address Setup Prior to Chip Select

Data Hold Time After Chip Select

Write Enable Hold Time After Chip Select

Address Hold Time After Chip Select

Chip Select Minimum Pulse Width

tCSD

tCSW

tCSA

tCHD

tCHW

tCHA

tCS

0

0

0

1.0

0

2.0

4.0

—

—

—

—

—

—

—

ns

Guaranteed but not tested on

standard product. See Figure 1.

Rise and Fall Time

Address to Output

CS to Output

tr, tf

0.6

0.6

2.5

2.5

ns

Measured between 20% and 80%

points.

Capacitance

Input Capacitance

Output Capacitance

Cin

Cout

—

—

6.0

8.0

pF

Measured with a pulse technique.

capacitive loads up to 50 pF.

2. The maximum Address Access Time is guaranteed to be the worst-case bit in the memory.

3. For proper use of MECL in a system environment, consult MECL System Design Handbook.

FIGURE 1 — CHIP ENABLE STROBE MODE

A

DIN

WE

CS

TCSA

TCSW

TCSD

TCS

TCHA

TCHD

TCHW