MC10H186

2–283

MOTOROLA

MECL Data

DL122 — Rev 6

OUTLINE DIMENSIONS

P SUFFIX

PLASTIC DIP PACKAGE

CASE 648–08

ISSUE R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

–A–

B

F

C

S

H

G

D

J

L

M

16 PL

SEATING

18

9

16

K

PLANE

–T–

M

A

M

0.25 (0.010)

T

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.740

0.770

18.80

19.55

B

0.250

0.270

6.35

6.85

C

0.145

0.175

3.69

4.44

D

0.015

0.021

0.39

0.53

F

0.040

0.70

1.02

1.77

G

0.100 BSC

2.54 BSC

H

0.050 BSC

1.27 BSC

J

0.008

0.015

0.21

0.38

K

0.110

0.130

2.80

3.30

L

0.295

0.305

7.50

7.74

M

0

10

0

10

S

0.020

0.040

0.51

1.01

_

_

_

_

L SUFFIX

CERAMIC DIP PACKAGE

CASE 620–10

ISSUE V

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSION F MAY NARROW TO 0.76 (0.030)

WHERE THE LEAD ENTERS THE CERAMIC

BODY.

–A–

–B–

–T–

F

E

G

N

K

C

SEATING

PLANE

16 PL

D

S

A

M

0.25 (0.010)

T

16 PL

J

S

B

M

0.25 (0.010)

T

M

L

DIM

MIN

MAX

MIN

MAX

MILLIMETERS

INCHES

A

0.750

0.785

19.05

19.93

B

0.240

0.295

6.10

7.49

C

–––

0.200

–––

5.08

D

0.015

0.020

0.39

0.50

E

0.050 BSC

1.27 BSC

F

0.055

0.065

1.40

1.65

G

0.100 BSC

2.54 BSC

H

0.008

0.015

0.21

0.38

K

0.125

0.170

3.18

4.31

L

0.300 BSC

7.62 BSC

M

0

15

0

15

N

0.020

0.040

0.51

1.01

__

__

16

9

18

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MC10H186/D

*MC10H186/D*

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