SI-3003KWF

1 A, Low-Dropout,

Dual Output,

1.8 V & 2.5 V Regulator

115 Northeast Cutoff, Box 15036

Worcester, Massachusetts 01615-0036

Linear

Regulators

6

Input Capacitor (C

either when the input line includes inductance or when the

wiring is long.

Output Capacitor (C

designed for a use with a very low ESR output capacitor

such as a ceramic capacitor. Output oscillation may occur

with that kind of capacitor.

ENABLE Input. The ENABLE (control) input features

an internal pull-up resistor. Leaving this input open causes

the output to turn on.

Parallel Operation. Parallel operation to increase load

current is not permitted.

Determination of DC Input Voltage. The minimum

input voltage V

fixed output voltage and the maximum rated dropout

voltage.

Overcurrent Protection. The SI-3000KWF series has

a built-in fold-back type overcurrent protection circuit,

which limits the output current at a start-up mode. It thus

cannot be used in applications that require current at the

start-up mode such as:

(1) constant-current load,

(2) power supply with positive and negative outputs to

common load (a center-tap type power supply), or

(3) raising the output voltage by putting a diode or a

resistor between the device ground and system ground.

Thermal Protection. Circuitry turns off the pass

transistor when the junction temperature rises above 135°C.

It is intended only to protect the device from failures due to

excessive junction temperatures and should not imply that

output short circuits or continuous overloads are permitted.

APPLICATIONS INFORMATION

Heat Radiation and Reliability. The reliability of the

IC is directly related to the junction temperature (T

operation. Accordingly, careful consideration should be

given to heat dissipation.

The inner frame on which the integrated circuit is mounted

is connected to the GND terminal (pin 3). Therefore, it is

very effective for heat radiation to enlarge the copper area

that is connected to the GND terminal. The graph on page

2 illustrates the effect of thermal resistance on the allow-

able package power dissipation.

The junction temperature (T

either of the following equations:

T

or

T

where P