MC74AC08, MC74ACT08

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5

MARKING DIAGRAMS

A

= Assembly Location

WL, L

= Wafer Lot

YY, Y

= Year

WW, W = Work Week

PDIP−14

SOIC−14

TSSOP−14

MC74AC08N

AWLYYWW

AC08

AWLYWW

AC

08

ALYW

ACT

08

ALYW

ACT08

AWLYWW

MC74ACT08N

AWLYYWW

74AC08

ALYW

SOEIAJ−14

74ACT08

ALYW

ORDERING INFORMATION

Device

Package

MC74AC08N

PDIP−14

500 Units / Rail

MC74AC08D

SOIC−14

55 Units / Rail

MC74AC08DR2

TSSOP−14

2500 / Tape & Reel

MC74AC08DTR2

TSSOP−14

(Pb−Free)

2500 / Tape & Reel

MC74AC08MEL

SOEIAJ−14

(Pb−Free)

2000 / Tape & Reel

MC74ACT08N

PDIP−14

500 Units / Rail

MC74ACT08D

SOIC−14

55 Units / Rail

MC74ACT08DR2

SOIC−14

2500 / Tape & Reel

MC74ACT08DTR2G

SOIC−14

(Pb−Free)

2500 / Tape & Reel

MC74ACT08NG

PDIP−14

(Pb−Free)

500 Units / Rail

MC74ACT08MEL

SOEIAJ−14

(Pb−Free)

2000 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.