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OPA375 Datenblatt(PDF) 35 Page - Texas Instruments

Teilenummer OPA375
Bauteilbeschribung  OPA375, OPA2375, OPA4375 500-關V (Maximum), 10-MHz, Low Broadband Noise, RRO, Operational Amplifier
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

OPA375 Datenblatt(HTML) 35 Page - Texas Instruments

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OPA375, OPA2375
www.ti.com
SBOS886B – NOVEMBER 2017 – REVISED JANUARY 2020
Product Folder Links: OPA375 OPA2375
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Copyright © 2017–2020, Texas Instruments Incorporated
10 Power Supply Recommendations
The OPA2375 and OPA4375 devices are specified for operation from 1.7 V to 5.5 V (±0.85 V to ±2.75 V). The
OPA375 device is specified for operation from 2.25 V to 5.5 V (±1.125 V to ±2.75 V). Many specifications of the
OPAx375 family apply from –40°C to 125°C.
CAUTION
Supply voltages larger than 7 V can permanently damage the device (see the Absolute
Maximum Ratings).
Place 0.1-µF bypass capacitors close to the power-supply pins to reduce errors coupling in from noisy or high-
impedance power supplies. For more detailed information on bypass capacitor placement, see the Layout
Guidelines section.
11 Layout
11.1 Layout Guidelines
For best operational performance of the device, use good printed-circuit board (PCB) layout practices, including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole and the
operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-
impedance power sources local to the analog circuitry.
Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as
close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single-
supply applications.
Separate grounding for analog and digital portions of the circuitry is one of the simplest and most
effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to
ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to
physically separate digital and analog grounds, paying attention to the flow of the ground current.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as
possible. If these traces cannot be kept separate, crossing the sensitive trace perpendicularly is much
better than crossing in parallel with the noisy trace.
Place the external components as close to the device as possible. Keeping RF and RG close to the
inverting input minimizes parasitic capacitance, as shown in Figure 88.
Keep the length of input traces as short as possible. Always remember that the input traces are the most
sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly
reduce leakage currents from nearby traces that are at different potentials.


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