Datenblatt-Suchmaschine für elektronische Bauteile |
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TLV751 Datenblatt(PDF) 14 Page - Texas Instruments |
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TLV751 Datenblatt(HTML) 14 Page - Texas Instruments |
14 / 31 page VOUT(NOM) 0 V 0 mA VOUT VFOLDBACK ICL ISC IRATED IOUT Brickwall Foldback 14 TLV751 SBVS385B – DECEMBER 2019 – REVISED APRIL 2020 www.ti.com Product Folder Links: TLV751 Submit Documentation Feedback Copyright © 2019–2020, Texas Instruments Incorporated Feature Description (continued) For this device, VFOLDBACK = 0.4 V × VOUT(NOM). The output voltage is not regulated when the device is in current limit. When a current limit event occurs, the device begins to heat up because of the increase in power dissipation. When the device is in brickwall current limit, the pass transistor dissipates power [(VIN – VOUT) × ICL]. When the device output is shorted and the output is below VFOLDBACK, the pass transistor dissipates power [(VIN – VOUT) × ISC]. If thermal shutdown is triggered, the device turns off. After the device cools down, the internal thermal shutdown circuit turns the device back on. If the output current fault condition continues, the device cycles between current limit and thermal shutdown. For more information on current limits, see the Know Your Limits application report. Figure 37 shows a diagram of the foldback current limit. Figure 37. Foldback Current Limit 7.3.4 Thermal Shutdown Thermal shutdown protection disables the output when the junction temperature rises to approximately 170°C. Disabling the device eliminates the power dissipated by the device, allowing the device to cool. When the junction temperature cools to approximately 155°C, the output circuitry is again enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits regulator dissipation, protecting the LDO from damage as a result of overheating. Activating the thermal shutdown feature usually indicates excessive power dissipation as a result of the product of the (VIN – VOUT) voltage and the load current. For reliable operation, limit junction temperature to 125°C maximum. To estimate the margin of safety in a complete design, increase the ambient temperature until the thermal protection is triggered; use worst-case loads and signal conditions. The TLV751 internal protection circuitry protects against overload conditions but is not intended to be activated in normal operation. Continuously running the TLV751 into thermal shutdown degrades device reliability. |
Ähnliche Teilenummer - TLV751_V01 |
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Ähnliche Beschreibung - TLV751_V01 |
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