Datenblatt-Suchmaschine für elektronische Bauteile |
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TMAG5124 Datenblatt(PDF) 17 Page - Texas Instruments |
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TMAG5124 Datenblatt(HTML) 17 Page - Texas Instruments |
17 / 24 page VCC GND TEST Ambiant Temperature (°C) 0 20 40 60 80 100 120 140 5 10 15 20 25 30 35 40 17 TMAG5124 www.ti.com SLYS016 – JUNE 2020 Product Folder Links: TMAG5124 Submit Documentation Feedback Copyright © 2020, Texas Instruments Incorporated Power Derating (continued) Figure 23. Power Derating Curve 11 Layout 11.1 Layout Guidelines The bypass capacitor should be placed near the TMAG5124 to reduce noise. The TEST pin must be connected directly to the GND pin. A good practice would be to connect them passing under the package to reduce the connection length. Generally, using PCB copper planes underneath the TMAG5124 device has no effect on magnetic flux, and does not interfere with device performance. This is because copper is not a ferromagnetic material. However, If nearby system components contain iron or nickel, they may redirect magnetic flux in unpredictable ways. 11.2 Layout Example Figure 24. TMAG5124 Layout Example |
Ähnliche Teilenummer - TMAG5124 |
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Ähnliche Beschreibung - TMAG5124 |
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