Datenblatt-Suchmaschine für elektronische Bauteile |
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LM3203TL Datenblatt(PDF) 10 Page - National Semiconductor (TI) |
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LM3203TL Datenblatt(HTML) 10 Page - National Semiconductor (TI) |
10 / 15 page Block Diagram 20141635 Operation Description The LM3203 is a simple, step-down DC-DC converter with a bypass switch, optimized for powering RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery powered RF devices. It is designed to allow the RF PA to operate at maximum efficiency over a wide range of power levels from a single Li-Ion battery cell. It is based on current-mode buck architecture, with synchronous rectifica- tion for high efficiency. It is designed for a maximum load capability of 500mA. Maximum load range may vary from this depending on input voltage, output voltage and the inductor chosen. The device has all three of the pin-selectable operating modes required for powering RF PAs in mobile phones and other sophisticated portable device with complex power management needs. Fixed-frequency PWM operation offers regulated output at high efficiency while minimizing interfer- ence with sensitive IF and data acquisition circuits. Bypass mode turns on an internal FET bypass switch to power the PA directly from the battery. This helps the RF power ampli- fier maintain its operating power during low battery condi- tions by reducing the dropout voltage across the LM3203. Shutdown mode turns the device off and reduces battery consumption to 0.1µA (typ.). DC PWM mode output voltage precision is +/-2% for 1.2V OUT. Efficiency is typically around 96% for a 150mA load with 3.2V output, 3.6V input. PWM mode quiescent current is 0.675 mA (typ.). The FB pin voltage is dynamically program- mable from 0.267V to 1.2V by adjusting the voltage on the V CON. External divider resistors can change the output voltge range. This ensures longer battery life by being able to change the PA supply voltage dynamically depending on its transmitting power. Additional features include current overload protection, over voltage protection and thermal shutdown. The LM3203 is constructed using a chip-scale 10-pin micro SMD package. This package offers the smallest possible size, for space-critical applications such as cell phones, where board area is an important design consideration. Use of a high switching frequency (2MHz typ.) reduces the size of external components. Use of a micro SMD package requires special design considerations for implementation. (See Mi- cro SMD Package Assembly and use in the Applications Information section.) Its fine bump-pitch requires careful board design and precision assembly equipment. Use of this package is best suited for opaque-case applications, where its edges are not subject to high-intensity ambient red or infrared light. Also, the system controller should set EN low during power-up and other low supply voltage conditions. (See Shutdown Mode in the Device Information section.) www.national.com 10 |
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