YTV F1 Series AOI
• Quick Set-up
• High Speed
• High Defect Coverage
• Low False Failure Rate
• Best Price Performance
YESTech’s advanced Thin Camera™ technology
offers high-speed PCB inspection with
exceptional defect coverage. With up
to
t
wo top-down viewing cameras and four side
viewing cameras, the F1-Series inspects
solder joints and verifies correct part
assembly enabling users to improve quality
and increase throughput.
Programming the F1-Series is fast and intuitive. Operators typically take less than 30 minutes to create a
complete inspection program including solder inspection. The F1-Series utilizes a standard package library
to simplify training and insure program portability across manufacturing lines.
Newly available image processing technology integrates several techniques, including color,
normalized correlation and rule-based algorithms, to provide complete inspection coverage with an
extremely low false failure rate.
Configurable for all line positions, the F1-Series is equally
effective for paste, pre / post-reflow or final assembly inspection.
Off-line programming maximizes machine utilization and real-time
SPC monitoring provides a valuable yield enhancement solution.
Automated
PCB
Inspection
Automated Inspection for:
•
Solder defects
•
Lead defects
•
Component presence
and position
•
Correct part / polarity
•
Through-hole parts
•
Paste
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