Datenblatt-Suchmaschine für elektronische Bauteile |
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74AHCT30D Datenblatt(PDF) 10 Page - NXP Semiconductors |
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74AHCT30D Datenblatt(HTML) 10 Page - NXP Semiconductors |
10 / 16 page 1999 Nov 30 10 Philips Semiconductors Product specification 8-input NAND gate 74AHC30; 74AHCT30 PACKAGE OUTLINES UNIT A max. A1 A2 A3 bp cD(1) E(1) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC EIAJ mm inches 1.75 0.25 0.10 1.45 1.25 0.25 0.49 0.36 0.25 0.19 8.75 8.55 4.0 3.8 1.27 6.2 5.8 0.7 0.6 0.7 0.3 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 1.0 0.4 SOT108-1 X w M θ A A1 A2 b p D HE L p Q detail X E Z e c L v M A (A ) 3 A 7 8 1 14 y 076E06S MS-012AB pin 1 index 0.069 0.010 0.004 0.057 0.049 0.01 0.019 0.014 0.0100 0.0075 0.35 0.34 0.16 0.15 0.050 1.05 0.041 0.244 0.228 0.028 0.024 0.028 0.012 0.01 0.25 0.01 0.004 0.039 0.016 95-01-23 97-05-22 0 2.5 5 mm scale SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 |
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Ähnliche Beschreibung - 74AHCT30D |
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