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MC100EPT21DTR2G Datenblatt(PDF) 2 Page - ON Semiconductor

Teilenummer MC100EPT21DTR2G
Bauteilbeschribung  3.3V Differential LVPECL/LVDS/CML to LVTTL/LVCMOS Translator
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Hersteller  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

MC100EPT21DTR2G Datenblatt(HTML) 2 Page - ON Semiconductor

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MC100EPT21
http://onsemi.com
2
1
2
3
45
6
7
8
Q
GND
VCC
Figure 1. Logic Diagram and 8−Lead Pinout (Top View)
D
NC
D
VBB
NC
LVTTL
LVPECL
Table 1. PIN DESCRIPTION
PIN
Q
D**, D**
Differential LVPECL/LVDS/CML Input
FUNCTION
LVTTL/LVCMOS Output
VCC
VBB
Output Reference Voltage
Positive Supply
GND
Ground
NC
No Connect
** Pins will default to VCC/2 when left open.
EP
Exposed pad must be connected to a
sufficient thermal conduit. Electrically
connect to the most negative supply or
leave floating open.
Table 2. ATTRIBUTES
Characteristics
Value
Internal Input Pulldown Resistor
50 k
W
Internal Input Pullup Resistor
50 k
W
ESD Protection
Human Body Model
Machine Model
Charged Device Model
> 1.5 kV
> 100 V
> 2 kV
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)
Level 1
Flammability Rating
Oxygen Index: 28 to 34
UL 94 V−0 @ 0.125 in
Transistor Count
81 Devices
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test
1. For additional information, see Application Note AND8003/D.
Table 3. MAXIMUM RATINGS
Symbol
Parameter
Condition 1
Condition 2
Rating
Unit
VCC
PECL Power Supply
GND = 0 V
3.8
V
VIN
PECL Input Voltage
GND = 0 V
VI  VCC
0 to 3.8
V
IBB
VBB Sink/Source
± 0.5
mA
TA
Operating Temperature Range
−40 to +85
°C
Tstg
Storage Temperature Range
−65 to +150
°C
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
SO−8
SO−8
190
130
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
SO−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
TSSOP−8
TSSOP−8
185
140
°C/W
°C/W
qJC
Thermal Resistance (Junction−to−Case)
Standard Board
TSSOP−8
41 to 44
°C/W
qJA
Thermal Resistance (Junction−to−Ambient)
0 lfpm
500 lfpm
DFN8
DFN8
129
84
°C/W
°C/W
Tsol
Wave Solder
Pb
Pb−Free
< 2 to 3 sec @ 248
°C
<2 to 3 sec @ 260
°C
265
265
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.


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