Datenblatt-Suchmaschine für elektronische Bauteile |
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MC100EPT21DTR2G Datenblatt(PDF) 2 Page - ON Semiconductor |
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MC100EPT21DTR2G Datenblatt(HTML) 2 Page - ON Semiconductor |
2 / 8 page MC100EPT21 http://onsemi.com 2 1 2 3 45 6 7 8 Q GND VCC Figure 1. Logic Diagram and 8−Lead Pinout (Top View) D NC D VBB NC LVTTL LVPECL Table 1. PIN DESCRIPTION PIN Q D**, D** Differential LVPECL/LVDS/CML Input FUNCTION LVTTL/LVCMOS Output VCC VBB Output Reference Voltage Positive Supply GND Ground NC No Connect ** Pins will default to VCC/2 when left open. EP Exposed pad must be connected to a sufficient thermal conduit. Electrically connect to the most negative supply or leave floating open. Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor 50 k W Internal Input Pullup Resistor 50 k W ESD Protection Human Body Model Machine Model Charged Device Model > 1.5 kV > 100 V > 2 kV Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Level 1 Flammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in Transistor Count 81 Devices Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. Table 3. MAXIMUM RATINGS Symbol Parameter Condition 1 Condition 2 Rating Unit VCC PECL Power Supply GND = 0 V 3.8 V VIN PECL Input Voltage GND = 0 V VI VCC 0 to 3.8 V IBB VBB Sink/Source ± 0.5 mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm SO−8 SO−8 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board SO−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm TSSOP−8 TSSOP−8 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board TSSOP−8 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm DFN8 DFN8 129 84 °C/W °C/W Tsol Wave Solder Pb Pb−Free < 2 to 3 sec @ 248 °C <2 to 3 sec @ 260 °C 265 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. |
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