NBSG16MNG datasheet(11/12 Pages) ONSEMI

Teilenummer	NBSG16MNG

Bauteilbeschribung	2.5V/3.3V SiGe Differential Receiver/Driver with RSECL Outputs

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NBSG16

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11

PACKAGE DIMENSIONS

FCBGA−16

BA SUFFIX

PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE

CASE 489−01

ISSUE O

0.20

LASER MARK FOR PIN 1

IDENTIFICATION IN

THIS AREA

D

E

M

A1

A2

A

0.10 Z

0.15 Z

ROTATED 90 CLOCKWISE

DETAIL K

_

5

VIEW M−M

e

3 X

S

M

X

0.15

Y

Z

0.08

Z

3

b

16 X

FEDUCIAL FOR PIN A1

IDENTIFICATION IN THIS AREA

43

21

A

B

C

D

4

16 X

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

3. DIMENSION b IS MEASURED AT THE MAXIMUM

SOLDER BALL DIAMETER, PARALLEL TO DATUM

PLANE Z.

4. DATUM Z (SEATING PLANE) IS DEFINED BY THE

SPHERICAL CROWNS OF THE SOLDER BALLS.

5. PARALLELISM MEASUREMENT SHALL EXCLUDE

ANY EFFECT OF MARK ON TOP SURFACE OF

PACKAGE.

DIM

MIN

MAX

MILLIMETERS

A

1.40 MAX

A1

0.25

0.35

A2

1.20 REF

b

0.30

0.50

D

4.00 BSC

E

4.00 BSC

e

1.00 BSC

S

0.50 BSC

K

−X−

−Y−

M

−Z−

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