Datenblatt-Suchmaschine für elektronische Bauteile |
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LM1117F-XX Datenblatt(PDF) 11 Page - HTC Korea TAEJIN Technology Co. |
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LM1117F-XX Datenblatt(HTML) 11 Page - HTC Korea TAEJIN Technology Co. |
11 / 11 page 1A L.D.O. VOLTAGE REGULATOR LM1117S/RS/F Maximum Output Current Capability The LM1117 can deliver a continuous current of 1A over the full operating junction temperature range. However, the current is limited by the restriction of power dissipation which differs from packages. A heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of application. With respect to th applied package, the maximum output current of 1A may be still undeliverable due to the restriction of the power diss of LM1117. Under all possible conditions, the junction temperature must be within the range specified under operating conditions. The temperatures over the device are given by: TC = TA + PD X θCA TJ = TC + PD X θJC TJ = TA + PD X θJA TJ is the junction temperature, TC is the case temperature, TA is the ambient temperature, PD is the total power dissi of the device, θCA is the thermal resistance of case-to-ambient, θJC is the thermal resistance of junction-to-case, and θJA is the thermal resistance of junction to ambient. The total power dissipation of the device is given by PD = PIN – POUT = (VIN X IIN)–(VOUT X IOUT) = (VIN X (IOUT+IGND)) – (VOUT X IOUT) = (VIN - VOUT) X IOUT + VIN X IGND where IGND is the operating ground current of the device which is specified at the Electrical Characteristics. The max allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the application and the maximum allowable junction temperature (TJmax): TRmax = TJmax – TAmax The maximum allowable value for junction-to-ambient thermal resistance, θ JA, can be calculated using the formula: θJA = TRmax / PD LM1117 is available in SOT223, TO252 packages. The thermal resistance depends on amount of copper area or he and on air flow. If the maximum allowable value of θJA calculated above is over 130°C/W for SO-223 package, over for TO252 package, no heat sink is needed since the package can dissipate enough heat to satisfy these requirements. If the value for allowable θJA falls near or below these limits, a heat sink or proper area of cop plane is required. In summary, the absolute maximum ratings of thermal resistances are as follow: Absolute Maximum Ratings of Thermal Resistance No heat sink / No air flow / No adjacent heat source / 0.066 inch 2 copper area Jan. 2007 - Rev 1.0 HTC Max. Rating Unit Thermal Resistance Junction-To-Ambient / TO252 θJA-TO252 93 °C/W Thermal Resistance Junction-To-Ambient / SOT223 θJA-SOT223 130 °C/W Characteristic Symbol 11 Thermal Resistance Junction-To-Ambient / SOT89 θJA-SOT89 315 °C/W |
Ähnliche Teilenummer - LM1117F-XX |
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Ähnliche Beschreibung - LM1117F-XX |
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