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AM29BDS643GT5GVAI Datenblatt(PDF) 5 Page - Advanced Micro Devices

Teilenummer AM29BDS643GT5GVAI
Bauteilbeschribung  64 Megabit (4 M x 16-Bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst Mode Flash Memory
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Hersteller  AMD [Advanced Micro Devices]
Direct Link  http://www.amd.com
Logo AMD - Advanced Micro Devices

AM29BDS643GT5GVAI Datenblatt(HTML) 5 Page - Advanced Micro Devices

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May 8, 2006 25692A2
Am29BDS643G
3
D A TA
SH EE T
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram of
Simultaneous Operation Circuit . . . . . . . . . . . . . . 5
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . 6
Special Handling Instructions for FBGA Package .................... 6
Input/Output Descriptions . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . . 9
Table 1. Device Bus Operations .......................................................9
Requirements for Asynchronous Read Operation (Non-Burst) 9
Requirements for Synchronous (Burst) Read Operation .......... 9
Continuous Burst ...................................................................... 9
8-, 16-, and 32-Word Linear Burst with Wrap Around ............ 10
Table 2. Burst Address Groups .......................................................10
Programmable Wait State ...................................................... 10
Handshaking Feature ............................................................. 10
Power Saving Function ........................................................... 11
Simultaneous Read/Write Operations with Zero Latency ....... 11
Writing Commands/Command Sequences ............................ 11
Accelerated Program Operation ............................................. 11
Autoselect Functions .............................................................. 11
Automatic Sleep Mode ........................................................... 12
RESET#: Hardware Reset Input ............................................. 12
Output Disable Mode .............................................................. 12
Hardware Data Protection ...................................................... 12
Low VCC Write Inhibit ............................................................ 12
Write Pulse “Glitch” Protection ............................................... 12
Logical Inhibit .......................................................................... 12
Common Flash Memory Interface (CFI) . . . . . . . 13
Table 3. CFI Query Identification String ..........................................13
Table 4. System Interface String .....................................................14
Table 5. Device Geometry Definition ..............................................14
Table 6. Primary Vendor-Specific Extended Query ........................15
Table 7. Sector Address Table ........................................................16
Command Definitions . . . . . . . . . . . . . . . . . . . . . . 20
Reading Array Data ................................................................ 20
Set Configuration Register Command Sequence ................... 20
Table 8. Burst Modes ......................................................................20
Handshaking Feature ............................................................. 20
Table 9. Wait States for Handshaking .............................................21
Enable PS (Power Saving) Mode Command Sequence ........ 21
Sector Lock/Unlock Command Sequence .............................. 21
Reset Command ..................................................................... 21
Autoselect Command Sequence ............................................ 21
Program Command Sequence ............................................... 22
Unlock Bypass Command Sequence ..................................... 22
Figure 1. Program Operation .......................................................... 23
Chip Erase Command Sequence ........................................... 23
Sector Erase Command Sequence ........................................ 23
Erase Suspend/Erase Resume Commands ........................... 24
Figure 2. Erase Operation.............................................................. 24
Table 10. Command Definitions .................................................... 25
Write Operation Status . . . . . . . . . . . . . . . . . . . . 26
DQ7: Data# Polling ................................................................. 26
Figure 3. Data# Polling Algorithm .................................................. 26
DQ6: Toggle Bit I .................................................................... 27
Figure 4. Toggle Bit Algorithm........................................................ 27
DQ2: Toggle Bit II ................................................................... 28
Table 11. DQ6 and DQ2 Indications .............................................. 28
Reading Toggle Bits DQ6/DQ2 ............................................... 28
DQ5: Exceeded Timing Limits ................................................ 28
DQ3: Sector Erase Timer ....................................................... 29
Table 12. Write Operation Status ................................................... 29
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 30
Figure 5. Maximum Negative Overshoot Waveform ...................... 30
Figure 6. Maximum Positive Overshoot Waveform........................ 30
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 30
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 31
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 7. Test Setup....................................................................... 32
Table 13. Test Specifications ......................................................... 32
Key to Switching Waveforms. . . . . . . . . . . . . . . . 32
Switching Waveforms. . . . . . . . . . . . . . . . . . . . . . 32
Figure 8. Input Waveforms and
Measurement Levels...................................................................... 32
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 33
Synchronous/Burst Read ........................................................ 33
Figure 9. Burst Mode Read (66 and 54 MHz) ................................ 33
Figure 10. Burst Mode Read (40 MHz) .......................................... 34
Asynchronous Read ............................................................... 35
Figure 11. Asynchronous Mode Read............................................ 35
Figure 12. Reset Timings ............................................................... 36
Erase/Program Operations ..................................................... 37
Figure 13. Program Operation Timings.......................................... 38
Figure 14. Chip/Sector Erase Operations ...................................... 39
Figure 15. Accelerated Unlock Bypass Programming Timing........ 40
Figure 16. Data# Polling Timings (During Embedded Algorithm) .. 41
Figure 17. Toggle Bit Timings (During Embedded Algorithm)........ 41
Figure 18. 8-, 16-, and 32-Word Linear Burst
Address Wrap Around.................................................................... 42
Figure 19. Latency with Boundary Crossing (54 MHz and 66 MHz) 42
Figure 20. Initial Access with Power Saving (PS)
Function and Address Boundary Latency ...................................... 43
Figure 21. Example of Extended Valid Address Reducing Wait State
Usage............................................................................................. 43
Figure 22. Back-to-Back Read/Write Cycle Timings ...................... 44
Erase and Programming Performance . . . . . . . 45
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Physical Dimensions* . . . . . . . . . . . . . . . . . . . . . 46
VDA044—44-Ball Very Thin Fine-Pitch Ball Grid Array
(FBGA) 9.2 x 8.0 mm Package ............................................... 46
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 47


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