ULTRACHIP
High-Voltage Mixed-Signal IC
©2000
4
Product Specifications
PIN DESCRIPTION
Name
Type
Pins
Description
MAIN POWER SUPPLY
VDD1
VDD2
VDD3
PWR
VDD1 supplies for display data RAM and digital logic, VDD2 supplies for
VLCD/VB generator, VDD3 supplies for VREF and other analog circuits.
VDD2/VDD3 should be connected to the same power source. But VDD1 can
be connected to a source voltage no higher than VDD2/VDD3.
In COG applications, always use separate ITO traces for VDD1, VDD2 and
VDD3 to reduce noise coupling.
VSS
VSS2
GND
Ground. In COG applications, use separate ITO traces to connect VSS
and VSS2 to the separate GND pins or to the shared GND pin and
minimize both ITO resistance.
LCD POWER SUPPLY
VB1+
VB1–
VB0–
VB0+
PWR
LCD Offset Voltages. Connect two CB capacitors between VB+ to VB0+
and VB0– to V B–. For optimum operation result, minimize the ITO trace
resistance of these nodes.
Place CB1 and CB0 on the FPC or COF to reduce I/O pin count by 4.
VLCD-IN
VLCD-OUT
PWR
Main LCD Power Supply. When internal VLCD is used, connect these
pins together. When external VLCD source is used, connect external
VLCD source to VLCD-IN pins and leave VLCD-OUT pins open.
A by-pass capacitor CL should be connected between VLCD and VSS2.
Minimize the ITO trace resistance in COG applications.
NOTE
•
Recommended capacitor values:
CB: 150~500x LCD load capacitance or 1.0uF (VBR > 3V), whichever is higher.
CL: 20~50x LCD load capacitance or 0.2uF (VBR > VLCD+1V), whichever is higher.
Name
I/O
Pins
Description
LCD DRIVE OUTPUT (UP TO 198 PINS)
C0,
~
C101
HV
LCD column driver outputs. Support up to 102 columns.
Leave unused drivers open-circuit.
RIC
HV
LCD icon driver outputs. RIC has two pads. These two pads are used to
drive icons. Leave unused drivers open-circuit.
R1,
R3, ...
R63
R2,
R4, …
HV
LCD row driver outputs. Support up to 64 rows.
Drivers for even and odd row are group into two separate groups along
the two sides of the IC. Leave unused drivers open-circuit.
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