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TC1015-2.5VCT713 Datenblatt(PDF) 2 Page - Microchip Technology |
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TC1015-2.5VCT713 Datenblatt(HTML) 2 Page - Microchip Technology |
2 / 22 page TC1014/TC1015/TC1185 DS21335E-page 2 © 2007 Microchip Technology Inc. 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Input Voltage .........................................................6.5V Output Voltage........................... (-0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 7) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C † Notice: Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. TC1014/TC1015/TC1185 ELECTRICAL SPECIFICATIONS Electrical Specifications: VIN = VR + 1V, IL = 100 µA, CL = 1.0 µF, SHDN > VIH, TA = +25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameter Symbol Min Typ Max Units Device Test Conditions Input Operating Voltage VIN 2.7 — 6.0 V— Note 1 Maximum Output Current IOUTMAX 50 100 150 — — — — — — mA TC1014 TC1015 TC1185 Output Voltage VOUT VR – 2.5% VR ±0.5% VR + 2.5% V— Note 2 VOUT Temperature Coefficient TCVOUT — — 20 40 — — ppm/°C — Note 3 Line Regulation ΔVOUT/ ΔVIN —0.05 0c.35 %— (VR + 1V) ≤ VIN ≤ 6V Load Regulation ΔVOUT/ VOUT — — 0.5 0.5 2 3 % TC1014; TC1015 TC1185 IL = 0.1 mA to IOUTMAX IL = 0.1 mA to IOUTMAX (Note 4) Dropout Voltage VIN-VOUT — — — — — 2 65 85 180 270 — — 120 250 400 mV — — — TC1015; TC1185 TC1185 IL = 100 µA IL = 20 mA IL = 50 mA IL = 100 mA IL = 150 mA (Note 5) Supply Current (Note 8) IIN —50 80 µA — SHDN = VIH, IL = 0 Shutdown Supply Current IINSD — 0.05 0.5 µA — SHDN = 0V Power Supply Rejection Ratio PSRR —64 — dB — FRE ≤ 1kHz Output Short Circuit Current IOUTSC —300 450 mA — VOUT = 0V Thermal Regulation ΔVOUT/ ΔPD —0.04 — V/W — Notes 6, 7 Thermal Shutdown Die Temperature TSD —160 — °C — Thermal Shutdown Hysteresis ΔTSD —10 — °C — Note 1: The minimum VIN has to meet two conditions: VIN ≥ 2.7V and VIN ≥ VR + VDROPOUT. 2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V. 3: 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value at a 1V differential. 6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. 8: Apply for Junction Temperatures of -40°C to +85°C. TC VOUT = (VOUTMAX – VOUTMIN)x 106 VOUT x ΔT |
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