Datenblatt-Suchmaschine für elektronische Bauteile |
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TC1265-3.0VETTR Datenblatt(PDF) 3 Page - Microchip Technology |
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TC1265-3.0VETTR Datenblatt(HTML) 3 Page - Microchip Technology |
3 / 18 page © 2006 Microchip Technology Inc. DS21376D-page 3 TC1265 SHDN Input SHDN Input High Threshold VIH 45 —— %VIN SHDN Input Low Threshold VIL —— 15 %VIN ERROR Output (SOIC Only) Minimum Operating Voltage VMIN 1.0 — — V Output Logic Low Voltage VOL —— 400 mV 1 mA Flows to ERROR ERROR Threshold Voltage VTH — 0.95 x VR —V ERROR Positive Hysteresis VHYS —50 — mV Note 8 DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Parameters Sym Min Typ Max Units Conditions Note 1: VR is the regulator output voltage setting. 2: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1 mA to IOUTMAX. 3: 4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. 5: Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at a 1.5V differential. 6: Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms. 7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temper- ature and the thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipa- tion causes the device to initiate thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details. 8: Hysteresis voltage is referenced to VR. TCVOUT VOUTMAX VOUTMIN – () 10 6 – VOUT T Δ × ------------------------------------------------------------------------- = TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C. Parameters Sym Min Typ Max Units Conditions Temperature Ranges Specified Temperature Range TA -40 — +125 °C (Note 1) Operating Temperature Range TJ -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Package Resistances Thermal Resistance, 5L-DDPAK θJA —57 — °C/W Thermal Resistance, 5L-TO-220 θJA —71 — °C/W Thermal Resistance, 8L-SOIC θJA — 163 — °C/W Note 1: Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C). |
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