Datenblatt-Suchmaschine für elektronische Bauteile |
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TC221-40 Datenblatt(PDF) 1 Page - Texas Instruments |
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TC221-40 Datenblatt(HTML) 1 Page - Texas Instruments |
1 / 14 page TC221, TC225, TC227 SMALL-FORMAT CCD IMAGE SENSORS SOCS037C – DECEMBER 1991 – REVISED AUGUST 1997 Copyright © 1997, Texas Instruments Incorporated 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 • Full-Frame Operation – 190 (H) × 190 (V) Active Elements for TC221 – 285 (H) × 285 (V) Active Elements for TC225 – 102 (H) × 102 (V) Active Elements for TC227 • Dark-Reference Pixels • 9-µm Square Pixels • Single-Phase Clocking • Low Dark Current • Dynamic Range... More Than 60 dB • High Photoresponse Uniformity • High Sensitivity • Low-Noise Operation • Solid State Reliability With No Residual Imaging, Image Burn-In, Microphonics, or Image Distortion description The TC221, TC225 and TC227 are full-frame charge-coupled device (CCD) image sensors designed specifically for medical and industrial applications where ruggedness and small size are required. The image-area diagonal measures 1.3 mm for the TC227, 2.4 mm for the TC221, and 3.63 mm for the TC225. The image sensors contain, in addition to dark reference pixels, 190, 285, and 102 active lines with 190, 285, and 102 active pixels per line, respectively. The antiblooming feature is activated by supplying clock pulses to the antiblooming gate, an integral part of each image-sensing element. The charge is converted to signal voltage at 9.5 µV per electron by a high-performance structure with built-in automatic reset and a voltage-reference generator. The signal is further buffered by a low-noise two-stage source-follower amplifier to provide high output-drive capability. The TC221 and TC227 are supplied in 6-pin molded plastic packages; the TC225 is supplied in a 10-pin molded plastic package. The glass window can be cleaned using any standard method for cleaning optical assemblies or by wiping the surface with a cotton swab soaked in alcohol. This MOS device contains limited built-in gate protection. During storage or handling, the device leads should be shorted together or the device should be placed in conductive foam. In a circuit, unused inputs should always be connected to SUB. Under no circumstances should pin voltages exceed absolute maximum ratings. Avoid shorting OUTn to ADB during operation to prevent damage to the amplifier. The device can also be damaged if the output terminals are reverse-biased and an excessive current is allowed to flow. Specific guidelines for handling devices of this type are contained in the publication Guidelines for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices and Assemblies available from Texas Instruments. TC225 TC221 TC227 10 9 8 7 6 1 2 3 4 5 1 2 3 6 5 4 SUB OUT ADB SRG ABG IAG TRG SRG1 SRG2 ABG IAG SUB OUT1 OUT2 ADB NC SRG ABG IAG SUB OUT ADB 1 2 3 6 5 4 NC – No internal connection PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
Ähnliche Teilenummer - TC221-40 |
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Ähnliche Beschreibung - TC221-40 |
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