Datenblatt-Suchmaschine für elektronische Bauteile |
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TA2160FNG Datenblatt(PDF) 9 Page - Toshiba Semiconductor |
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TA2160FNG Datenblatt(HTML) 9 Page - Toshiba Semiconductor |
9 / 17 page TA2160FNG 2004-05-11 9 iv fO and fL The fL and fO should be set up out of the audio frequency range. In case that the fO and fL is inside of audio frequency range and AGC circuit operates, the voltage gain decrease. v HPF The fHC should be made 1/2 or less frequency as compared with the fL and fO. The phase difference is large near the fHC, so that the bass boost level runs short. And the HPF gain of middle or high frequency range should be set to 10dB or more. (3) Treble boost function This function is realized by using the PW NF terminal. For details, please refer to application note. 3. Total (1) Changeover of power amplifier output DC voltage at 3 V set. The output DC voltage of the power amplifier is raised by the resistance connected between the RF OUT terminal and the VREF IN terminal. In case of 3 V set, the dynamic range spreads. (2) Switch (a) Switch terminal The current flows through each terminal, in case that these terminals are connected with H level independently, evevn though the IC off mode. It is necessary to connect an external pull-down resistor with each terminal in case that IC is turned on due to external noise etc. The sensitivity of each switch is set up highly. (b) Pop noise It is advised to connect R and C with each switch, to reduce the pop noise in switchover (see Fig.1). It is better that the constants are R = 100 kΩ ,C = 1 µF. As for the constants, select the optimum one depending on each a set carefully. 0 10 k 0 2 4 6 8 10 12 0.5 1 1.5 2 2.5 VCC = 3 V VREF PW OUT ICCQ 20 k 50 k 100 k 200 k 500 k 1 M Resistance (PIN 26 – PIN 27) R (Ω) VREF, PW OUT, ICCQ – R Figure 5 Adjutment of output DC voltage VCC R C Figure 6 Pop noise |
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