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ST93CS67ML1013TR Datenblatt(PDF) 2 Page - STMicroelectronics

Teilenummer ST93CS67ML1013TR
Bauteilbeschribung  4K 256 x 16 SERIAL MICROWIRE EEPROM
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The data is then clocked out serially. The address
pointer is automatically incremented after the data
is output and, if the Chip Select input (S) is held
High, the ST93CS66/67 can output a sequential
stream of data words. In this way, the memory can
be read as a data stream of 16 to 4096 bits, or
continuously as the address counter automatically
rolls over to 00 when the highest address is
reached.
Within the time required by a programming cycle
(tW), up to 4 words may be written with the help of
the Page Write instruction; the whole memory may
also be erased, or set to a predetermined pattern,
by using the Write All instruction.
Within the memory, an user defined area may be
protected against further Write instructions. The
size of this area is defined by the content of a
Protect Register, located outside of the memory
array. As a final protection step, data may be per-
manently protected by programming a One Time
Programing bit (OTP bit) which locks the Protect
Register content.
Programming is internally self-timed (the external
clock signal on C input may be disconnected or left
running after the start of a Write cycle) and does
not require an erase cycle prior to the Write instruc-
tion. The Write instruction writes 16 bits at one time
into one of the 256 words, the Page Write instruc-
tion writes up to 4 words of 16 bits to sequential
locations, assuming in both cases that all ad-
dresses are outside the Write Protected area. After
the start of the programming cycle, a Ready/Busy
signal is available on the Data output (Q) when the
Chip Select (S) input pin is driven High.
VSS
Q
W
PRE
C
SVCC
D
AI00907B
ST93CS66
ST93CS67
1
2
3
4
8
7
6
5
Figure 2A. DIP Pin Connections
1
AI00908C
2
3
4
14
9
10
8NC
NC
QVSS
NC
VCC
ST93CS66
ST93CS67
NC
S
C
DW
NC
PRE
5
6
7
12
13
11
NC
Figure 2B. SO Pin Connections
DESCRIPTION (cont’d)
Warning: NC = Not Connected.
Symbol
Parameter
Value
Unit
TA
Ambient Operating Temperature
–40 to 85
°C
TSTG
Storage Temperature
–65 to 150
°C
TLEAD
Lead Temperature, Soldering
(SO14 package)
(PSDIP8 package)
40 sec
10 sec
215
260
°C
VIO
Input or Output Voltages (Q = VOH or Hi-Z)
–0.3 to VCC +0.5
V
VCC
Supply Voltage
–0.3 to 6.5
V
VESD
Electrostatic Discharge Voltage (Human Body model)
(2)
2000
V
Electrostatic Discharge Voltage (Machine model)
(3)
500
V
Notes: 1. Except for the rating ”Operating Temperature Range”, stresses above those listed in the Table ”Absolute Maximum Ratings”
may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other
conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum
Rating conditions for extended periods may affect device reliability. Refer also to the SGS-THOMSON SURE Program and other
relevant quality documents.
2. MIL-STD-883C, 3015.7 (100pF, 1500
Ω).
3. EIAJ IC-121 (Condition C) (200pF, 0
Ω).
Table 2. Absolute Maximum Ratings (1)
2/16
ST93CS66, ST93CS67


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