Datenblatt-Suchmaschine für elektronische Bauteile |
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TS951ILT Datenblatt(PDF) 8 Page - STMicroelectronics |
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TS951ILT Datenblatt(HTML) 8 Page - STMicroelectronics |
8 / 17 page Package information TS951-TS952-TS954 8/17 3 Package information In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. 3.1 SOT23-5 package information Figure 11. SOT23-5 package mechanical drawing Table 5. SOT23-5 package mechanical data Ref. Dimensions Millimeters Mils Min. Typ. Max. Min. Typ. Max. A 0.90 1.45 35.4 57.1 A1 0.00 0.15 0.00 5.9 A2 0.90 1.30 35.4 51.2 b 0.35 0.50 13.7 19.7 C 0.09 0.20 3.5 7.8 D 2.80 3.00 110.2 118.1 E 2.60 3.00 102.3 118.1 E1 1.50 1.75 59.0 68.8 e 0.95 37.4 e1 1.9 74.8 L 0.35 0.55 13.7 21.6 |
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