Datenblatt-Suchmaschine für elektronische Bauteile |
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TDA1175P Datenblatt(PDF) 7 Page - STMicroelectronics |
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TDA1175P Datenblatt(HTML) 7 Page - STMicroelectronics |
7 / 8 page Figure 7 : Maximum Power Dissipation and Junction-ambient Thermal Resistance versus ”I” Figure 8 : Maximum Allowable Power Dissipation versus Ambient Temperature The Rth (j-a) can be reduced by soldering the GND pins to a suitable copper area of the printed circuit board (Figure 5) or to an external heatsink (Fig- ure 6). The diagram of Figure 7 shows the maximum dissipable power Ptot and the Rth (j-a) as a function of the side ”I” of two equal square copper areas having a thicknessof 35 µ (1.4 mils). During soldering the pins temperature must not exceed 260 °C and the soldering time must not be longer than 12 seconds. The external heatsink or printed circuit copper area must be connected to electrical ground. MOUNTING INSTRUCTION Figure 5 : Example of P.C. Board Copper Area Figure 6 : External Heatsink Mounting Example TDA1175P 7/8 |
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