Datenblatt-Suchmaschine für elektronische Bauteile |
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CD4009UB Datenblatt(PDF) 5 Page - Texas Instruments |
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CD4009UB Datenblatt(HTML) 5 Page - Texas Instruments |
5 / 12 page PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) 89264UKB3T OBSOLETE CFP WR 16 None Call TI Call TI CD4009UBE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD4009UBF ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4009UBF3A ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4009UBM ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4009UBM96 ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4009UBMT ACTIVE SOIC D 16 250 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4009UBNSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4009UBPW ACTIVE TSSOP PW 16 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM CD4009UBPWR ACTIVE TSSOP PW 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM CD4010BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU Level-NC-NC-NC CD4010BF ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4010BF3A ACTIVE CDIP J 16 1 None Call TI Level-NC-NC-NC CD4010BM ACTIVE SOIC D 16 40 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4010BM96 ACTIVE SOIC D 16 2500 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4010BMT ACTIVE SOIC D 16 250 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4010BNSR ACTIVE SO NS 16 2000 Pb-Free (RoHS) CU NIPDAU Level-2-260C-1 YEAR/ Level-1-235C-UNLIM CD4010BPW ACTIVE TSSOP PW 16 90 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM CD4010BPWR ACTIVE TSSOP PW 16 2000 Pb-Free (RoHS) CU NIPDAU Level-1-250C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. None: Not yet available Lead (Pb-Free). Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens, including bromine (Br) or antimony (Sb) above 0.1% of total product weight. PACKAGE OPTION ADDENDUM www.ti.com 28-Feb-2005 Addendum-Page 1 |
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Ähnliche Beschreibung - CD4009UB |
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