Datenblatt-Suchmaschine für elektronische Bauteile |
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TL1454Y Datenblatt(PDF) 3 Page - Texas Instruments |
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TL1454Y Datenblatt(HTML) 3 Page - Texas Instruments |
3 / 24 page TL1454, TL1454Y DUAL-CHANNEL PULSE-WIDTH-MODULATION (PWM) CONTROL CIRCUIT SLVS086B – APRIL 1995 – REVISED NOVEMBER 1997 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251–1443 TL1454Y chip information This chip, when properly assembled, displays characteristics similar to the TL1454C. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. TL1454Y (2) (14) (1) (3) (4) (5) (6) (7) (8) (16) (13) (12) (11) (10) (9) REF DTC2 IN2+ IN2 – COMP2 VCC OUT2 OUT1 COMP1 IN1– IN1 + RT CT GND 86 108 (1) (2) (3) (4) (5) (6) (7) (10) (11) (12) (13) (14) (15) (16) (8) (9) (15) SCP DTC1 |
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