CYStech Electronics Corp.

Spec. No. : C710H8

Issued Date : 2009.05.07

Revised Date :

Page No. : 6/6

MTB06N03H8

CYStek Product Specification

Power pak Dimension

*: Typical

Inches

Millimeters

Inches

Millimeters

Device Name

Date Code

8-Lead power pak Plastic Package

CYStek Package Code: H8

Marking:

DIM

Min.

Max.

Min.

Max.

DIM

Min.

Max.

Min.

Max.

A

0.1890

0.1969

4.80

5.00

I

0.0161

0.0240

0.41

0.61

B

0.2244

0.2283

5.70

5.80

J

0.1331

0.1488

3.38

3.78

C

0.2323

0.2402

5.90

6.10

K

0.0433

-

1.10

-

D

0.0130

0.0201

0.33

0.51

L

0.0201

0.0280

0.51

0.71

E

0.0500*

1.27*

M

-

-

0

°

12

°

F

0.0354

0.0472

0.90

1.20

G

0.0067

0.0118

0.17

0.30

H

0.1445

0.1583

3.67

4.02

2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.

3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

• Lead: pure tin plated

• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0

Important Notice:

• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.

• CYStek reserves the right to make changes to its products without notice.

• CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.

• CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.