Datenblatt-Suchmaschine für elektronische Bauteile |
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74ABT827D Datenblatt(PDF) 10 Page - NXP Semiconductors |
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74ABT827D Datenblatt(HTML) 10 Page - NXP Semiconductors |
10 / 14 page 74ABT827_3 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 03 — 24 February 2010 10 of 14 NXP Semiconductors 74ABT827 10-bit buffer/line driver; non-inverting; 3-state Fig 10. Package outline SOT355-1 (TSSOP24) UNIT A1 A2 A3 bp cD(1) E(2) (1) eHE LLp QZ y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm 0.15 0.05 0.95 0.80 0.30 0.19 0.2 0.1 7.9 7.7 4.5 4.3 0.65 6.6 6.2 0.4 0.3 8 0 o o 0.13 0.1 0.2 1 DIMENSIONS (mm are the original dimensions) Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. 0.75 0.50 SOT355-1 MO-153 99-12-27 03-02-19 0.25 0.5 0.2 w M b p Z e 112 24 13 pin 1 index θ A A1 A2 L p Q detail X L (A ) 3 HE E c v M A X A D y 0 2.5 5 mm scale TSSOP24: plastic thin shrink small outline package; 24 leads; body width 4.4 mm SOT355-1 A max. 1.1 |
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Ähnliche Beschreibung - 74ABT827D |
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