HIGH VOLTAGE CERAMIC CHIP CAPACITOR-SMD

TS18H

S

P

E

C

I

F

I

C

A

T

I

O

N

S

Resistance

to Flexure

Stresses

Appearance

No crack or marked

defects should occur.

Solder the capacitor on the

test jig,using a eutectic

solder.Then apply a force

in the direction.

Deflection:1mm

Speed: 1mm/sec

△

C/C

Class I ：≤±5%

Class II：≤±10%

Resistance

to Soldering

Heat

Appearance

No defects,≥90% of each

terminal should be covered

with fresh solder

Preheat the capacitor at 100 to 200℃ for 10±2 minute.Immerse the

capacitor in a eutectic solder at 265±5℃ for 5±1 seconds.Store at

room temperature for 24±2 hours before measureing electric properties.

△

C/C

Class I: ≤±0.5% or

±0.5pF

（

whichever is larger）

Class II:

X7R X5R: -5~+10%

Y5V Z5U: -10～+20%

D.F.

Meets Initial Values

(As Above)

I.R.

Meets Initial Values

(As Above)

Temperature

Cycle

Appearance

No visual defect

Perform a heat temperature at 150+0/-10℃ for 1hrs,then place room

temp. for 24±2hrs.

△

C/C

Class I: ≤±1% or

±1pF

（

whichever is larger）

Fix the capacitor to the supporting jig,Perform the five cycles according

to the four heat treatments listed in the following table.Store at room

temperature for 24±2 hours before measureing electric properties.

Class II:

X7R X5R ≤±10%

Step

Temperature（℃）

Time (min.)

Z5U Y5V ≤±20%

1

Low-category temp.

30

D.F.

Meets Initial Values

(As Above)

2

25±2

3

3

High-category temp.

30

I.R.

Meets Initial Values

(As Above)

4

25±2

3

Suntan

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