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74LVC16244ADL Datenblatt(PDF) 2 Page - NXP Semiconductors

Teilenummer 74LVC16244ADL
Bauteilbeschribung  16-bit buffer/line driver; 5 V input/output tolerant; 3-state
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Hersteller  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

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74LVC_LVCH16244A_9
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 09 — 18 March 2010
2 of 19
NXP Semiconductors
74LVC16244A; 74LVCH16244A
16-bit buffer/line driver; 5 V input/output tolerant; 3-state
3.
Ordering information
4.
Functional diagram
Table 1.
Ordering information
Type number
Temperature range
Package
Name
Description
Version
74LVC16244ADL
−40 °C to +125 °C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
74LVCH16244ADL
74LVC16244ADGG
−40 °C to +125 °C
TSSOP48
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
74LVCH16244ADGG
74LVC16244AEV
−40 °C to +125 °C
VFBGA56
plastic very thin fine-pitch ball grid array package;
56 balls; body 4.5
× 7 × 0.65 mm
SOT702-1
74LVCH16244AEV
74LVC16244ABQ
−40 °C to +125 °C
HXQFN60U plastic thermal enhanced extremely thin quad flat
package; no leads; 60 terminals; UTLP based;
body 4 x 6 x 0.5 mm
SOT1134-1
74LVCH16244ABQ
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
Fig 1.
Logic symbol
Fig 2.
IEC logic symbol
001aae506
47
46
44
43
2
3
5
6
1A0
1A1
1A2
1A3
1Y0
1Y1
1Y2
1Y3
1
1OE
36
35
33
32
13
14
16
17
3A0
3A1
3A2
3A3
3Y0
3Y1
3Y2
3Y3
25
3OE
30
29
27
26
19
20
22
23
4A0
4A1
4A2
4A3
4Y0
4Y1
4Y2
4Y3
24
4OE
41
40
38
37
8
9
11
12
2A0
2A1
2A2
2A3
2Y0
2Y1
2Y2
2Y3
48
2OE
1
1
1
1
1
3
2
4
001aae231
33
32
30
29
27
26
16
17
19
20
22
23
47
46
44
43
41
40
38
37
36
35
2
3
5
6
8
9
11
12
13
14
24
25
1A0
1A1
1A2
1A3
2A0
2A1
2A2
2A3
3A0
3A1
3A2
3A3
4A0
4A1
4A2
4A3
1Y0
1Y1
1Y2
1Y3
2Y0
2Y1
2Y2
2Y3
3Y0
3Y1
3Y2
3Y3
4Y0
4Y1
4Y2
4Y3
48
1
4OE
1OE
2OE
3OE
EN1
EN2
EN3
EN4


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