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TDA18273C1 Datenblatt(PDF) 4 Page - NXP Semiconductors |
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TDA18273C1 Datenblatt(HTML) 4 Page - NXP Semiconductors |
4 / 10 page TDA18273HN_SDS All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product short data sheet Rev. 3 — 10 May 2011 4 of 10 NXP Semiconductors TDA18273HN Hybrid (analog and digital) Silicon Tuner for terrestrial and cable TV reception 6. Limiting values [1] The maximum allowed ambient temperature Tamb(max) depends on the assembly conditions of the package and especially on the design of the Printed-Circuit Board (PCB) and die connection. The application mounting must be done in such a way that the maximum junction temperature is never exceeded. The junction temperature can be obtained by reading the temperature sensor bit via I2C-bus. The junction temperature: Tj = Tamb + ΔTj-c. where ΔTj-c = power × Rth. [2] Class III: 500 V to 1000 V. 7. Abbreviations Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCC supply voltage −0.3 +3.6 V VI input voltage VCC <3.3 V −0.3 VCC +0.3 V VCC >3.3 V −0.3 +3.6 V Tstg storage temperature −40 +150 °C Tj junction temperature - 125 °C Tamb ambient temperature −20 [1] °C VESD electrostatic discharge voltage EIA/JESD22-A114 (HBM) −2+2 kV EIA/JESD22-C101-C (FCDM) class III[2] 750 - V Table 4. Abbreviations Acronym Description AGC Automatic Gain Control AGCK Automatic Gain Control step Killer CB Citizen Band DVB Digital Video Broadcasting DVB-T/T2/C/C2/H DVB-Terrestrial/Terrestrial second generation/Cable/Handheld FCDM Field-induced Charged-Device Model FRAC-N Fractional-N HBM Human Body Model IF Intermediate Frequency IR Image Rejection LC-VCO Inductors and Capacitors - Voltage Controlled Oscillator LNA Low-Noise Amplifier LO Local Oscillator PCB Printed-Circuit Board PLD Power Level Detector RF Radio Frequency RoHS Restriction of Hazardous Substances SAW Surface Acoustic Wave UHF Ultra High Frequency |
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