LCS700-708 datasheet(9/26 Pages) POWERINT

Teilenummer	LCS700-708

Bauteilbeschribung	Integrated LLC Controller, High-Voltage Power MOSFETs and Drivers

Download	26 Pages

Scroll/Zoom	100%

Hersteller	POWERINT [Power Integrations, Inc.]

Direct Link	http://www.powerint.com

Logo

9 / 26 page

Rev. B 062011

9

LCS700-708

www.powerint.com

Bootstrap Circuit and HB Node Layout

Please refer to Figure 10. Note the location of the bootstrap diode,

capacitor, resistor, and the HB trace routing. The objective is to

keep them away from the small signal components and traces,

such as the feedback optocoupler. Do not unnecessarily

increase the area of the PCB traces on this node, because it will

increase the dv/dt (capacitive) coupling to low-voltage circuits.

Heat Sink Grounding

The exposed metal in the back of the HiperLCS package is

internally connected to the GROUND pin. If the HiperLCS has a

dedicated heat sink and there is no electrical insulator between

the device and the heat sink, the heat sink should be floating and

not electrically connected anywhere else. If the heat sink is

shared with other devices in the system, and the heat sink

requires grounding to minimize EMI, a thin insulator is strongly

recommended under the HiperLCS, for improved noise, surge,

and system-level ESD immunity. The resulting increase in thermal

resistance must be considered in the thermal design.

Transformer Secondary

The transformer secondary pins, output diodes, and main output

capacitors should be positioned close together and routed with

short thick traces. This is

critical for secondary current symmetry

and to minimize output diode inverse voltage stress. The use of

ceramic capacitors allows placement between the transformer

secondary pins and the output rectifier, producing a very tight

layout. See Figure 11. The secondary winding halves should be

inter-twined together before they are wound on the bobbin. This

minimizes the leakage inductance between them and greatly

improves current symmetry and minimizes output diode inverse

voltage stress. For a 2-output design the half-windings of a given

output need to be intertwined.

Figure 9.

Placement of B+ and B- High-Voltage Bypass Capacitors.

SOURCE

DRAIN

Ähnliche Beschreibung - LCS700-708

Hersteller	Teilenummer	Datenblatt	Bauteilbeschribung
Power Integrations, Inc...	LCS700HG	2Mb / 30P	Integrated LLC Controller, High-Voltage Power MOSFETs and Drivers May 2017
ON Semiconductor	NCP1398	636Kb / 24P	High Performance Resonant Mode Controller with Integrated High-Voltage Drivers January, 2013 ??Rev. 0
	NCP1397	427Kb / 27P	High Performance Resonant Mode Controller with Integrated High-Voltage Drivers October, 2015 ??Rev. 6
	NCP1398B	704Kb / 24P	High Performance Resonant Mode Controller with Integrated High-Voltage Drivers January, 2013 ??Rev. 0
	NCP1398	636Kb / 24P	High Performance Resonant Mode Controller with Integrated High-Voltage Drivers January, 2013 ??Rev. 0
	NCP1398B	636Kb / 24P	High Performance Resonant Mode Controller with Integrated High-Voltage Drivers January, 2013 ??Rev. 0
	NCP1397	427Kb / 27P	High Performance Resonant Mode Controller with Integrated High-Voltage Drivers October, 2015 ??Rev. 6
	NCP1397A	749Kb / 27P	High Performance Resonant Mode Controller with Integrated High-Voltage Drivers November, 2011 ??Rev. 4
	NCP1399	677Kb / 44P	High Performance Current Mode Resonant Controller with Integrated High- Voltage Drivers February, 2016 ??Rev. 4
	NCP13994	866Kb / 45P	High Performance Current Mode Resonant Controller with Integrated High-Voltage Drivers July, 2022 - Rev. 0

More results

LCS700-708 Datenblatt(PDF) 9 Page - Power Integrations, Inc.

LCS700-708 Datenblatt(HTML) 9 Page - Power Integrations, Inc.

Ähnliche Teilenummer - LCS700-708

Ähnliche Beschreibung - LCS700-708

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26

Datenblatt Download

Link URL