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Document Number: 88383

193

Revision: 18-Apr-11

This document is subject to change without notice.

SM6A27

Vishay General Semiconductor

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

DO-218AB

Mounting Pad Layout

0.413 (10.5)

0.374 (9.5)

0.091 (2.3)

0.067 (1.7)

0.116 (3.0)

0.093 (2.4)

0.150 (3.8)

0.126 (3.2)

0.366 (9.3)

0.343 (8.7)

0.606 (15.4)

0.583 (14.8)

0.116 (3.0)

0.093 (2.4)

0.628 (16.0)

0.592 (15.0)

0.539 (13.7)

0.524 (13.3)

0.366 (9.3)

0.343 (8.7)

0.406 (10.3)

0.382 (9.7)

0.342 (8.7)

0.327 (8.3)

0.413 (10.5)

0.374 (9.5)

0.028 (0.7)

0.020 (0.5)

0.138 (3.5)

0.098 (2.5)

Lead 1

0.098 (2.5)

0.059 (1.5)

Lead 2/Metal Heatsink

0.197 (5.0)

0.185 (4.7)

0.016 (0.4) MIN.