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TS3DV621 Datenblatt(PDF) 5 Page - Texas Instruments

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Teilenummer TS3DV621
Bauteilbeschribung  12-Channel 1:2 MUX/DEMUX Switch with Integrated 4-Channel Sideband Signal Switching
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

TS3DV621 Datenblatt(HTML) 5 Page - Texas Instruments

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TS3DV621
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SCDS330B – JANUARY 2012 – REVISED MAY 2012
ABSOLUTE MAXIMUM RATINGS
(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
VCC
Supply voltage range
-0.5
4.6
V
VI/O
Analog voltage range(2)(3)(4)
All I/O
–0.5
7
V
VIN
Digital input voltage range(2)(3)
SEL1, SEL2
–0.5
7
V
II/OK
Analog port diode current
VI/O < 0
–50
mA
IIK
Digital input clamp current
VIN < 0
–50
mA
II/O
On-state switch current(5)
All I/O
–128
128
mA
IDD
Continuous current through VDD or GND
–100
100
mA
IGND
θJA
Package thermal impedance(6)
RUA package
31.8
°C/W
Tstg
Storage temperature range
–65
150
°C
(1)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating
conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
All voltages are with respect to ground, unless otherwise specified.
(3)
The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4)
VI and VO are used to denote specific conditions for VI/O.
(5)
II and IO are used to denote specific conditions for II/O.
(6)
The package thermal impedance is calculated in accordance with JESD 51-7
RECOMMENDED OPERATING CONDITIONS
(1)
MIN
MAX
UNIT
VCC
Supply voltage
3
3.6
V
VIH
High-level control input voltage
SEL1, SEL2
2
5.5
V
VIL
Low-level control input voltage
SEL1, SEL2
0
0.8
V
VIN
Input voltage
SEL1, SEL2
0
5.5
V
VI/O
Input/Output voltage
0
5.5
V
TA
Operating free-air temperature
–40
85
°C
(1)
All unused control inputs of the device must be held at VDD or GND to ensure proper device operation. Refer to the TI application
report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2012, Texas Instruments Incorporated
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