Datenblatt-Suchmaschine für elektronische Bauteile |
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SM32VC5510AGGWA2EP Datenblatt(PDF) 11 Page - Texas Instruments |
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SM32VC5510AGGWA2EP Datenblatt(HTML) 11 Page - Texas Instruments |
11 / 82 page Introduction 3 August 2003 − Revised November 2003 SGUS045A Texas Instruments (TI) has also developed foundation software available for the 5510. The C55x DSP Library (DSPLIB) features over 50 C-callable software kernels (FIR/IIR filters, Fast Fourier Transforms (FFTs), and various computational functions). The DSP Image/Video Processing Library (IMGLIB) contains over 20 software kernels highly optimized for C55x DSPs and is compiled with the latest revision of the C55x DSP code generation tools. These imaging functions support a wide range of applications that include compression, video processing, machine vision, and medical imaging. The TMS320C55x DSP core was created with an open architecture that allows the addition of application-specific hardware to boost performance on specific algorithms. The hardware extensions on the 5510 strike the perfect balance of fixed function performance with programmable flexibility, while achieving low-power consumption, and cost that traditionally has been difficult to find in the video-processor market. The extensions allow the 5510 to deliver exceptional video codec performance with more than half its bandwidth available for performing additional functions such as color space conversion, user-interface operations, security, TCP/IP, voice recognition, and text-to-speech conversion. As a result, a single 5510 DSP can power most portable digital video applications with processing headroom to spare. For more information, see the TMS320C55x Hardware Extensions for Image/Video Applications Programmer’s Reference (literature number SPRU098). For more information on using the the DSP Image Processing Library, see the TMS320C55x Image/Video Processing Library Programmer’s Reference (literature number SPRU037). 2.2 Pin Assignments Figure 2−1 illustrates the ball locations for the 240-pin ball grid array (BGA) package and is used in conjunction with Table 2−1 to locate signal names and ball grid numbers. 15 16 13 14 11 10 9 78 12 U T P M N L K J R 56 3 24 G E F D B C 1 A H 17 Figure 2−1. 320VC5510 GGW MicroStar BGA Package (Bottom View) |
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