Datenblatt-Suchmaschine für elektronische Bauteile |
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ISL267450IUZ Datenblatt(PDF) 3 Page - Intersil Corporation |
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ISL267450IUZ Datenblatt(HTML) 3 Page - Intersil Corporation |
3 / 19 page ISL267450 3 FN8341.0 August 10, 2012 Ordering Information PART NUMBER (Notes 1, 2, 3) PART MARKING VDD RANGE (V) TEMP RANGE (°C) PACKAGE (PB-free) PKG. DWG. # ISL267450IBZ 267450 IBZ 2.7 to 5.25 -40 to +85 8 Ld SOIC M8.15 ISL267450IUZ 67450 2.7 to 5.25 -40 to +85 8 Ld MSOP M8.118 NOTES: 1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications. 2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. 3. For Moisture Sensitivity Level (MSL), please see device information page for ISL267450. For more information on MSL please see techbrief TB363. |
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