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SN74ABT5402DW Datenblatt(PDF) 2 Page - Texas Instruments

Teilenummer SN74ABT5402DW
Bauteilbeschribung  12-BIT LINE/MEMORY DRIVERS WITH 3-STATE OUTPUTS
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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SN74ABT5402DW Datenblatt(HTML) 2 Page - Texas Instruments

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SN54ABT5402, SN74ABT5402
12BIT LINE/MEMORY DRIVERS
WITH 3STATE OUTPUTS
SCBS100B − JANUARY 1992 − REVISED JULY 1994
6−2
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
POST OFFICE BOX 1443
HOUSTON, TEXAS 77251−1443
logic symbol
logic diagram (positive logic)
28
D1
27
D2
26
D3
25
D4
24
D5
Y1
1
Y2
2
Y3
3
Y4
4
Y5
5
Y6
6
Y7
8
Y8
9
23
D6
22
D7
20
D8
15
14
OE1
OE2
EN
&
Y9
10
Y10
11
19
D9
18
D10
Y1
To 11 Other Channels
OE1
OE2
D1
28
1
15
14
1
17
D11
Y11
12
16
D12
Y12
13
† This symbol is in accordance with ANSI/IEEE Std 91-1984
and IEC Publication 617-12.
Pin numbers shown are for the DW and JT packages.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1)
−0.5 V to 7 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage range applied to any output in the high state or power-off state, VO
−0.5 V to 5.5 V
. . . . . . . . . . . . .
Current into any output in the low state, IO
30 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0)
−18 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0)
−50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DW package
1.2 W
. . . . . . . . . . . . . . . . . . .
Storage temperature range
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
‡ Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150
°C and a board trace length of 750 mils.
For more information, refer to the Package Thermal Considerations application note in the 1994 ABT Advanced BiCMOS Technology
Data Book, literature number SCBD002B.


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