Datenblatt-Suchmaschine für elektronische Bauteile |
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SN74AC245IDWREP Datenblatt(PDF) 1 Page - Texas Instruments |
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SN74AC245IDWREP Datenblatt(HTML) 1 Page - Texas Instruments |
1 / 10 page SN74AC245EP OCTAL BUS TRANSCEIVER WITH 3STATE OUTPUTS SCAS780 − OCTOBER 2004 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 D Controlled Baseline − One Assembly/Test Site, One Fabrication Site D Enhanced Diminishing Manufacturing Sources (DMS) Support D Enhanced Product-Change Notification D Qualification Pedigree† D 2-V to 6-V VCC Operation D Inputs Accept Voltages to 6 V D Max tpd of 7 ns at 5 V † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. description/ordering information The SN74AC245 octal bus transceiver is designed for asynchronous two-way communication between data buses. The control-function implementation minimizes external timing requirements. When the output-enable (OE) is low, the device passes noninverted data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction control (DIR) input. A high on OE disables the device so that the buses are effectively isolated. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. ORDERING INFORMATION TA PACKAGE‡ ORDERABLE PART NUMBER TOP-SIDE MARKING −40 °C to 85°C SOIC − DW Tape and reel SN74AC245IDWREP SAC245IEP ‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE INPUTS OPERATION OE DIR OPERATION L L H L H X B data to A bus A data to B bus Isolation Copyright 2004, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. DW PACKAGE (TOP VIEW) 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 DIR A1 A2 A3 A4 A5 A6 A7 A8 GND VCC OE B1 B2 B3 B4 B5 B6 B7 B8 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. |
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