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SN74AC245IDWREP Datenblatt(PDF) 1 Page - Texas Instruments

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Teilenummer SN74AC245IDWREP
Bauteilbeschribung  OCTAL BUFFER/DRIVER WITH 3-STATE OUTPUTS
Download  10 Pages
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

SN74AC245IDWREP Datenblatt(HTML) 1 Page - Texas Instruments

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SN74AC245EP
OCTAL BUS TRANSCEIVER
WITH 3STATE OUTPUTS
SCAS780 − OCTOBER 2004
1
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
D Controlled Baseline
− One Assembly/Test Site, One Fabrication
Site
D Enhanced Diminishing Manufacturing
Sources (DMS) Support
D Enhanced Product-Change Notification
D Qualification Pedigree
D 2-V to 6-V VCC Operation
D Inputs Accept Voltages to 6 V
D Max tpd of 7 ns at 5 V
† Component qualification in accordance with JEDEC and industry
standards to ensure reliable operation over an extended
temperature range. This includes, but is not limited to, Highly
Accelerated Stress Test (HAST) or biased 85/85, temperature
cycle, autoclave or unbiased HAST, electromigration, bond
intermetallic life, and mold compound life. Such qualification
testing should not be viewed as justifying use of this component
beyond specified performance and environmental limits.
description/ordering information
The SN74AC245 octal bus transceiver is designed for asynchronous two-way communication between data
buses. The control-function implementation minimizes external timing requirements.
When the output-enable (OE) is low, the device passes noninverted data from the A bus to the B bus or from
the B bus to the A bus, depending on the logic level at the direction control (DIR) input. A high on OE disables
the device so that the buses are effectively isolated.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE‡
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
−40
°C to 85°C
SOIC − DW
Tape and reel
SN74AC245IDWREP
SAC245IEP
‡ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
INPUTS
OPERATION
OE
DIR
OPERATION
L
L
H
L
H
X
B data to A bus
A data to B bus
Isolation
Copyright
 2004, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
DW PACKAGE
(TOP VIEW)
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
DIR
A1
A2
A3
A4
A5
A6
A7
A8
GND
VCC
OE
B1
B2
B3
B4
B5
B6
B7
B8
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.


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