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TC1301 Datenblatt(PDF) 6 Page - Transcom, Inc.

Teilenummer TC1301
Bauteilbeschribung  Low Noise and Medium Power GaAs FETs
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Hersteller  TRANSCOM [Transcom, Inc.]
Direct Link  http://www.transcominc.com.tw
Logo TRANSCOM - Transcom, Inc.

TC1301 Datenblatt(HTML) 6 Page - Transcom, Inc.

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TC1301
REV5_20070502
TRANSCOM, INC., 90 Dasoong 7th Road, Tainan Science-Based Industrial Park, Hsin-She Shiang, Tainan County, Taiwan, R.O.C.
Web-Site: www.transcominc.com.tw
Phone: 886-6-5050086
Fax: 886-6-5051602
6 / 6
SCHEMATIC
TOM2 MODEL PARAMETERS
Parameters
Parameters
VTO
-0.43283 V
VMAX
0.5
V
ALPHA
9.54
CGD
0.0554 pF
BETA
0.49
CGS
6.018 pF
GAMMA
0.0416
CDS
0.1599 pF
DELTA
0.3091
RIS
5.755 Ohm
Q
0.84
RID
0.001 Ohm
NG
0.1
VBR
9 V
ND
0.01
RDB
94.333 Ohm
TAU
5.558 ps
CBS
0.0463 pF
RG
2.0833 Ohm
TNOM
25
°C
RD
1.358 Ohm
LS
0.01893 nH
RS
1.662 Ohm
LG
0.0576 nH
IS
1E-11 mA
LD
0.038 nH
N
1
AFAC
1
VBI
1 V
NFING
1
VDELTA
0.2 V
CHIP HANDLING
DIE ATTACHMENT: Conductive epoxy or eutectic die attach is recommended. Eutectic die attach can be
accomplished with Au-Sn (80%Au-20%Sn) perform at stage temperature: 290
°C ± 5°C; Handling Tool: Tweezers;
Time: less than 1min.
WIRE BONDING: The recommended wire bond method is thermocompression bonding with 0.7 to 1.0 mil
(0.018 to 0.025 mm) gold wire. Stage temperature: 220
°C to 250°C; Bond Tip Temperature: 150°C; Bond Force:
20 to 30 gms depending on size of wire and Bond Tip Temperature.
HANDLING PRECAUTIONS: The user must operate in a clean, dry environment. Care should be exercised
during handling avoid damage to the devices. Electrostatic Discharge (ESD) precautions should be observed at all
stages of storage, handling, assembly, and testing. The static discharge must be less than 300V.
Cgs
Cgd
Cds
Rg
Rd
Rdb
Ris
Rs
Id
Lg
Ld
Ls
Cbs
Rid


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