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SB1316-H Datenblatt(PDF) 2 Page - KODENSHI_AUK CORP.

Teilenummer SB1316-H
Bauteilbeschribung  1.6mm(L)횞0.8mm small size surface mount type
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Hersteller  KODENSHI [KODENSHI_AUK CORP.]
Direct Link  http://www.kodenshi.co.kr
Logo KODENSHI - KODENSHI_AUK CORP.

SB1316-H Datenblatt(HTML) 2 Page - KODENSHI_AUK CORP.

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AUK CORP.
SB1316-H
The contents of this data sheet are subject to change without advance notice for the purpose of improvement.
When using this product, would you please refer to the latest specifications.
Rev.Odate:08-AUG-11
AUK-LDM-001(A)
4. Absolute Maximum Ratings
(Ta=25
oC)
Characteristic
Symbol
Rating
Unit
Power dissipation
PD
68
mW
Forward current
IF
20
mA
*1 Peak forward current
IFP
50
mA
Reverse voltage
VR
4
V
Operating temperature range
Topr
-25
∼80
Storage temperature range
Tstg
-30
∼100
*2 Soldering temperature
Tsol
240
℃ for 5 seconds
*1.Duty ratio = 1/16, Pulse width = 0.1ms
*2.Recommended reflow soldering temperature profile
- Preheating 150
℃ to 185℃ within 120 seconds soldering 240℃ within 10 seconds
Gradual cooling (Avoid quenching)
max. 10sec
Temp (
℃)
Time (sec)
185
150
240
Peak Temp max. 240
Preheating area
150~185
℃, 90±30sec
max. 3
℃/sec
25
Time from 25
℃ to Peak Temperature max. 6min
Solder area
220
℃, max. 60sec
max. 4
℃/sec
max. -6
℃/sec
240
180
150
60
0


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