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AD5552BRZ Datenblatt(PDF) 5 Page - Analog Devices |
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AD5552BRZ Datenblatt(HTML) 5 Page - Analog Devices |
5 / 16 page AD5551/AD5552 Rev. A | Page 5 of 16 ABSOLUTE MAXIMUM RATINGS TA = 25°C unless otherwise noted Table 3. Parameter Rating VDD to AGND –0.3 V to +6 V Digital Input Voltage to DGND –0.3 V to VDD + 0.3 V VOUT to AGND –0.3 V to VDD + 0.3 V AGND, AGNDF, AGNDS to DGND –0.3 V to +0.3 V Input Current to Any Pin Except Supplies ±10 mA Operating Temperature Range Industrial (B Version) −40°C to +85°C Storage Temperature Range −65°C to +150°C Maximum Junction Temperature, (TJ max) 150°C Package Power Dissipation (TJ max – TA)/θJA Thermal Impedance θJA SOIC (R-8) 149.5°C/W SOIC (R-14) 104.5°C/W Lead Temperature, Soldering Peak Temperature1 260°C ESD2 5 kV 1 As per JEDEC Standard 20. 2 HBM classification. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. ESD CAUTION |
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