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CB042E0224 Datenblatt(PDF) 6 Page - AVX Corporation

Teilenummer CB042E0224
Bauteilbeschribung  Film Chip Capacitors PET-HT DIELECTRIC ??CB Series
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Hersteller  AVX [AVX Corporation]
Direct Link  http://www.avx.com
Logo AVX - AVX Corporation

CB042E0224 Datenblatt(HTML) 6 Page - AVX Corporation

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Film Chip Capacitors
PET-HT DIELECTRIC – CB Series
MOUNTING AND SOLDERING RECOMMENDATIONS
*Reflow soldering referring to JEDEC Standard with some limitations
*JEDEC J-Std 020C
SOLDERING PROFILE
The capacitors can be mounted using infrared and vapor phase soldering following recommended below. They are NOT
suitable for wave soldering.
All temperature refer to topside of the package, measured on the package body surface.
RECOMMENDED SOLDER PASTE THICKNESS
Profile Feature
2220 to 2824
4030 to 6054
Ramp-Up (Ts max to Tp)
3°C / second max
3°C / second max
Preheat
- Temperature Min (Ts min)
150°C
150°C
- Temperature Min (Ts max)
200°C
200°C
- Time (ts min to ts max)
180 sec. max
180 sec. max
Time maintained above
- Temperature (TL)
217°C
217°C
- Time (tL)
60 sec. max
75 sec. max
Peak temperature (Tp)
240°C
245°C
Time within 5°C of peak
10 sec.
10 sec.
temperature (tp)
Ramp-Down
6°C / sec.
6°C / sec.
For optimum solderability, the recommended soldering
paste thickness: 2220 to 2824 :150 to 200µm
4030 to 6054 :200 to 300µm
In case of hand soldering, the temperature of the soldering
iron should not be above 250°C. Special care must be taken
to avoid touching the capacitor body with the iron tip.
Size Code
Case Size
A
B
C
04
2220
5.00 (0.195)
1.90 (0.075)
4.50 (0.178)
05
2824
6.00 (0.234)
2.50 (0.098)
5.70 (0.224)
16
4030
7.50 (0.295)
3.00 (0.118)
8.00 (0.315)
17
5040
11.2 (0.441)
3.50 (0.137)
10.3 (0.406)
18
6064
14.6 (0.575)
3.60 (0.147)
12.6 (0.496)
PAD DIMENSIONS: millimeters (inches)
A
CB
RECOMMENDED CLEANING
To clean flux from the PC board assembly, the recommended
products are: ethanol, isopropyl alcohol, and deionized water
wash. The cleaning products to avoid are: Toluene, Xylene,
Trichloroethylene, Terpene Cleaner EC-7, surface active
agent. In case of using another solvent, please contact us.
OTHER CAUTIONS
Flame retardancy: the dielectric film is not a flame retardant
material.
Environment: contact us when chips are used in humid or
gas atmosphere and /or when using resin.
Recommended handling: do not use edged tools, so not
to damage the capacitors.
TIN WHISKERS TESTS : JEDEC STANDARD NO 22A121
Stress Type
Ref. Spec.
Test Conditions
Analysis
Results
Temperature cycling
JESD22-A104
-55°C +85(+10/-0)°C air
SEM x 1000
Pass
5 to 10 minutes soak 3 cycles/hour
Ambient Temperature /
30+/-2°C - 60+/-3% RH -2000H
SEM x 1000
Pass
Humidity Storage
High Temperature /
70+/-5°C - 93+3/-2% RH -1000H
SEM x 1000
Pass
Humidity Storage
030
Time (seconds)
60
90
120 150 180 210 240
Ramp
down
Ramp up
270 300 330
Tp
Tp - 5ºC
Ts min
Ts max
TL
tS
tp
tL


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