Datenblatt-Suchmaschine für elektronische Bauteile |
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9-147099-0 Datenblatt(PDF) 5 Page - Tyco Electronics |
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9-147099-0 Datenblatt(HTML) 5 Page - Tyco Electronics |
5 / 98 page 185 Catalog 1307819 Dimensions are in inches and Dimensions are shown for USA: 1-800-522-6752 South America: 55-11-2103-6000 Revised 8-08 millimeters unless otherwise reference purposes only. Canada: 1-905-470-4425 Hong Kong: 852-2735-1628 specified. Values in brackets Specifications subject Mexico: 01-800-733-8926 Japan: 81-44-844-8013 www.tycoelectronics.com are metric equivalents. to change. C. America: 52-55-1106-0803 UK: 44-8706-080-208 Mod IV Surface Mount Vertical Receptacle Assemblies, .100 x .100 [2.54 x 2.54] Centerline AMPMODU Interconnection System 5 The AMPMODU 0.025 [0.64] square interconnection system is an industry standard that has provided level III and IV thru-hole interconnections to almost every industry and marketplace for years. As technology advances, so has the AMPMODU product line. Surface mount vertical receptacle assemblies are available to meet your level II packaging needs as process technologies evolve from wave soldering to surface mount reflow (infrared and vapor-phase) processes. AMPMODU surface mount receptacle assemblies are offered in vertical dual entry configurations. These receptacles are available in single-row and double-row configurations with a contact centerline spacing of .100 x .100 [2.54 x 2.54]. AMPMODU surface mount vertical receptacle assemblies continue to provide the proven features and benefits of their thru-hole counterparts in the AMPMODU product family. Closed-entry style housing design provides a lead-in ramp for positive mating of contacts, virtually eliminating the possibility of stubbing. The dual-beam receptacle contact design, coupled with gold plating in the contact area, provides a reliable interface. Tin plating on the solder tails also enhances solderability. The incorporation of compliant metallic hold downs on receptacle assemblies offers multiple benefits. The hold downs provide for proper lead-to- pad registration and provide retention to the PC board prior to and during processing. Used with a plated thru-hole, the hold downs are soldered during the reflow process and serve as a strain relief for the solder joints during mating/unmating. The design of the hold downs results in an excellent ratio of insertion/extraction forces (into the PC board); 20 lb. [89 N] maximum insertion force per pair and 10 lb. [44.5 N] minimum extraction force per pair (unsoldered). No tools are required for insertion. Product Facts ■ Surface Mount Leads ■ Contact Material: phosphor bronze ■ High temperature, black thermoplastic housings, 94V-0 rated, capable of withstanding IR or vapor- phase reflow ■ Gold/tin duplex plating for reliable mating interconnection and solder interface ■ Metallic hold downs provide retention in the PC board prior to and during the reflow process … and strain relief after soldering ■ Hold downs provide for proper lead-to-pad registration ■ Closed-entry receptacle housings provide lead-in ramp for positive mating ■ Receptacle contacts employ dual cantilever beams for reliable connections ■ Recognized under the Component Program of Underwriters Laboratories Inc. File No. E28476 ■ Certified by Canadian Standards Association, File No. LR 7189 R R |
Ähnliche Teilenummer - 9-147099-0 |
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Ähnliche Beschreibung - 9-147099-0 |
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