Datenblatt-Suchmaschine für elektronische Bauteile |
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MC10XSC425EK Datenblatt(PDF) 10 Page - Freescale Semiconductor, Inc |
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MC10XSC425EK Datenblatt(HTML) 10 Page - Freescale Semiconductor, Inc |
10 / 56 page Analog Integrated Circuit Device Data 10 Freescale Semiconductor 10XSC425 THERMAL RATINGS TA TJ Operating Temperature •Ambient •Junction -40 to 125 -40 to 150 C (5) TSTG Storage Temperature -55 to 150 C THERMAL RESISTANCE RJC RJA Thermal Resistance • Junction to Case • Junction to Ambient <2.5 30 C/W (7) TSOLDER Peak Pin Reflow Temperature During Solder Mounting 260 C (8) Notes 6. To achieve high reliability over 10 years of continuous operation, the device's continuous operating junction temperature should not exceed 125 C. 7. Device mounted on a 2s2p test board per JEDEC JESD51-2. 15 °C/W of RθJA can be reached in a real application case (4 layers board). 8. Pin soldering temperature limit is for 40 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause malfunction or permanent damage to the device. Table 3. Maximum Ratings (continued) All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Symbol Ratings Value Unit Notes |
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